Method for producing a capping wafer for a sensor

Abstract

A method for producing a capping wafer for a sensor having at least one cap includes: production of a contacting via extending through the wafer, and, temporally subsequent thereto, filling of the contacting via with an electrically conductive material.

1 - 15 . (canceled) 
     
     
         16 . A sealing glass capping wafer, comprising:
 an electrical contact pin extending through the capping wafer; and   a first electrical terminal provided on the electrical contact pin for the electrical contacting of an electrical terminal of a sensor wafer;   wherein an electrical through-connection is provided by the electrical contact pin and the electrical terminal.   
     
     
         17 . The capping wafer as recited in  claim 16 , wherein the electrical contact pin has a second electrical terminal for the electrical contacting of an electrical terminal of a substrate. 
     
     
         18 . The capping wafer as recited in  claim 17 , wherein the electrical through-connection of the capping wafer is produced by electroplating. 
     
     
         19 . The capping wafer as recited in  claim 17 , wherein the first and second electrical terminals one of (i) lie externally on the capping wafer or (ii) stand away from the capping wafer. 
     
     
         20 . A microelectromechanical sensor system comprising:
 a sealing glass cap; and   a sensor element.   
     
     
         21 . The sensor system as recited in  claim 20 , wherein a solder bump is provided on an electrical rear side contact of an electrical contact pin of the sealing glass cap, and wherein an electrical terminal of a substrate is electrically contacted using the solder bump. 
     
     
         22 . A sensor system, comprising:
 a substrate; and   a sensor having a cap, a sensor element, and an electroplated electrical through-connection of the cap to the sensor element, wherein the electrical through-connection is electrically conductively connected directly to an electrical terminal of the substrate.