Self Fixturing Assembly Techniques

Abstract

A process, apparatus, and system for joining at least two workpieces together using at least two adhesives each having substantially different cure times. A first adhesive having a first cure time is used to form a first bond between the two workpieces, the first adhesive having a first cure time. A second adhesive having a second cure time, the second cure time being substantially shorter than the first cure time is used to form a fixturing bond. The fixturing bond maintaining the first and second workpieces in position prior to the first adhesive curing.

1 . A method for joining a first workpiece and a second workpiece together, wherein the first workpiece has at least one hole, the method comprising:
 applying a first adhesive to the first workpiece at an application region;   placing the first workpiece in contact with the second workpiece at the application region;   applying a second adhesive to the first workpiece within the at least one hole; and   curing the second adhesive before the first adhesive is fully cured.   
     
     
         2 . The method defined in  claim 1 , further comprising:
 performing additional assembly operations after the second adhesive is cured and before the first adhesive is fully cured.   
     
     
         3 . The method defined in  claim 1  wherein the first workpiece comprises a computer frame and wherein applying the first adhesive to the first workpiece comprises applying the adhesive to the computer frame. 
     
     
         4 . The method defined in  claim 1  wherein the second workpiece comprises a computer housing and wherein placing the first workpiece in contact with the second workpiece at the application region comprises placing the first workpiece in contact with the computer housing at the application region. 
     
     
         5 . The method defined in  claim 1  wherein the at least one hole comprises a plurality of attachment features and wherein applying the second adhesive to the first workpiece within the at least one hole comprises applying the second adhesive to the first workpiece within each attachment feature in the plurality of attachment features. 
     
     
         6 . The method defined in  claim 1  further comprising:
 after placing the first workpiece in contact with the second workpiece at the application region, applying a compression force to the first and second workpieces with a compression fixture. 
 
     
     
         7 . The method defined in  claim 6  further comprising:
 after curing the second adhesive, removing the compression force from the first and second workpieces. 
 
     
     
         8 . The method defined in  claim 1  wherein the first adhesive comprises an epoxy and wherein applying the first adhesive to the first workpiece at the application region comprises applying the epoxy to the first workpiece at the application region. 
     
     
         9 . The method defined in  claim 1  wherein the second adhesive comprises UV cure adhesive and wherein applying the second adhesive to the first workpiece within the at least one hole comprises applying the UV cure adhesive to the first workpiece at the application region. 
     
     
         10 . A computer assembly, comprising:
 a computer frame having at least one hole;   a computer housing;   a first adhesive in contact with the computer frame and the computer housing, wherein the first adhesive has a first cure time; and   a second adhesive within the at least one hole and in contact with the computer housing, wherein the second adhesive has a second cure time and wherein the first cure time is longer in than the second cure time.   
     
     
         11 . The computer assembly defined in  claim 10  wherein the first adhesive comprises an epoxy. 
     
     
         12 . The computer assembly defined in  claim 10  wherein the second adhesive comprises a UV cure adhesive. 
     
     
         13 . The computer assembly defined in  claim 10  wherein the computer frame comprises metal. 
     
     
         14 . The computer assembly defined in  claim 10  wherein the at least one hole comprises a plurality of attachment features. 
     
     
         15 . The computer assembly defined in  claim 10  wherein the second adhesive within the at least one hole forms a plug that presses the computer frame and the computer housing together. 
     
     
         16 . A method for forming a computer assembly, comprising:
 forming a first bond between a computer frame and a computer housing using a first adhesive;   applying a compression force to the computer frame and the computer housing to compress the first adhesive;   forming a second bond between the computer frame and the computer housing using a second adhesive; and   after the second adhesive has cured and before the first adhesive has cured, removing the compression force.   
     
     
         17 . The method defined in  claim 16  wherein forming the second bond comprises applying the second adhesive to a plurality of attachment features in the computer frame to form the second bond between the computer frame and the computer housing at the attachment features. 
     
     
         18 . The method defined in  claim 16 , further comprising:
 performing subsequent processing steps on the computer assembly after the second adhesive has cured and before the first adhesive has cured.   
     
     
         19 . The method defined in  claim 16  further comprising:
 while applying the compression force to the computer frame and the computer housing, exposing the second adhesive to UV light to cure the second adhesive. 
 
     
     
         20 . The method defined in  claim 16  wherein forming the second bond comprises filling at least one hole in the computer frame with the second adhesive to form a plug in the at least one hole, wherein the plug is configured to compress the computer frame against the computer housing while the first adhesive cures.