Photosensitive resin composition, cured product thereof, and printed wiring board

Abstract

Disclosed is a photosensitive resin composition which has excellent concealing properties for appearance defects of a circuit and the like, while having excellent coloring power and resolution that enable the formation of a high-resolution solder resist layer. Specifically disclosed is a photosensitive resin composition which contains a perylene coloring agent, a coloring agent that is in a complementary color relation with the perylene coloring agent, a carboxyl group-containing resin, a compound that contains two or more ethylenically unsaturated groups in each molecule, and a photopolymerization initiator.

1 . A photosensitive resin composition, comprising:
 a perylene coloring agent;   a coloring agent, which is in a complementary color relation with the perylene coloring agent;   a carboxyl group-comprising resin;   a compound comprising two or more ethylenically unsaturated groups in a molecule; and   a photopolymerization initiator.   
     
     
         2 . The photosensitive resin composition of  claim 1 , wherein a dry coating of the photosensitive resin composition having a thickness of from 18 to 22 μm has a light absorbance of 0.5 or less at a wavelength in a range of from 400 to 410 nm, and a cured product of the dry coating has an L* value of 40 or less and an a* value and a b* value that are each independently in a range of from −5 to 5 in the CIE L*a*b* Color Scale. 
     
     
         3 . A dry film, comprising a coating obtained by a process comprising:
 applying the photosensitive resin composition of  claim 1  on a film, to obtain a coated film; and   drying the coated film, thereby obtaining the dry film.   
     
     
         4 . A cured product, obtained by a process comprising:
 applying the photosensitive resin composition of  claim 1  on a substrate, to obtain a coated substrate;   drying the coated substrate, to obtain a dry coated substrate; and   photo-curing the dry coated substrate by irradiating the dry coated substrate with an active energy ray, thereby obtaining the cured product.   
     
     
         5 . A printed wiring board comprising a pattern of a cured product obtained by a process comprising:
 applying the photosensitive resin composition of  claim 1  on a substrate, to obtain a coated substrate;   drying the coated substrate, to obtain a dry coated substrate; and   photo-curing the dry coated substrate by irradiating the dry coated substrate with an active energy ray, thereby obtaining the cured product.   
     
     
         6 . A cured product, obtained by a process comprising:
 applying the photosensitive resin composition of  claim 1  on a film on a substrate, to obtain a coated substrate;   drying the coated substrate, to obtain a dry coated substrate;   laminating the dry coated substrate, to obtain a laminated substrate; and   photo-curing the laminated substrate by irradiating the laminated substrate with an active energy ray, thereby obtaining the cured product.   
     
     
         7 . A printed wiring board comprising a pattern of a cured product obtained by a process comprising:
 applying the photosensitive resin composition of  claim 1  on a film on a substrate, to obtain a coated substrate;   drying the coated substrate, to obtain a dry coated substrate;   laminating the dry coated substrate, to obtain a laminated substrate;   photo-curing the dry coated substrate by irradiating the dry coated substrate with an active energy ray, thereby obtaining the cured product.   
     
     
         8 . The photosensitive resin composition of  claim 1 , wherein a content of the perylene coloring agent in the photosensitive resin is from 0.01 to 8 parts by mass, based on 100 parts by mass of the carboxyl group-comprising resin. 
     
     
         9 . The photosensitive resin composition of  claim 1 , wherein a content of the perylene coloring agent in the photosensitive resin is from 0.05 to 5 parts by mass, based on 100 parts by mass of the carboxyl group-comprising resin. 
     
     
         10 . The photosensitive resin composition of  claim 1 , wherein a content of the complementary coloring agent in the photosensitive resin composition is from 0.01 to 8 parts by mass, based on 100 parts by mass of the carboxyl group-comprising resin. 
     
     
         11 . The photosensitive resin composition of  claim 1 , wherein a content of the complementary coloring agent in the photosensitive resin composition is from 0.05 to 5 parts by mass, based on 100 parts by mass of the carboxyl group-comprising resin. 
     
     
         12 . The photosensitive resin composition of  claim 1 , wherein the carboxyl group-comprising resin has an acid value in a range of from 40 to 200 mg KOH/g. 
     
     
         13 . The photosensitive resin composition of  claim 1 , wherein the carboxyl group-comprising resin has an acid value in a range of from 45 to 120 mg KOH/g. 
     
     
         14 . The photosensitive resin composition of  claim 1 , wherein the carboxyl group-comprising resin has a weight average molecular weight in a range from 2,000 to 150,000. 
     
     
         15 . The photosensitive resin composition of  claim 1 , wherein the carboxyl group-comprising resin has a weight average molecular weight in a range from 5,000 to 100,000. 
     
     
         16 . The photosensitive resin composition of  claim 1 , wherein a content of the carboxyl group-comprising resin in the photosensitive resin composition is 20 to 60 mass %, based on a total mass of the photosensitive resin composition. 
     
     
         17 . The photosensitive resin composition of  claim 1 , wherein a content of the carboxyl group-comprising resin in the photosensitive resin composition is 30 to 50 mass %, based on a total mass of the photosensitive resin composition. 
     
     
         18 . The photosensitive resin composition of  claim 1 , wherein the photopolymerization initiator is at least one of an oxime ester polymerization initiator, an α-aminoacetophenone photopolymerization initiator, and an acylphosphineoxide photopolymerization initiator.