Method of manufacturing a floor board

Abstract

A method of manufacturing a floor board comprises the steps of supplying a panel, printing a curable substance or surface removing substance onto the panel in a predefined pattern for creating an elevation on the panel at the pattern or removing a portion of the surface of the panel at the pattern, respectively, and curing the curable substance or removing any re-action products of the surface removing substance and the panel.

1 . A method of manufacturing a floor board, comprising:
 supplying a panel,   printing a curable substance or surface removing substance onto the panel in a predefined pattern for creating an elevation on the panel at the pattern or removing a portion of the surface of the panel at the pattern, respectively,   curing the curable substance or removing any reaction products of the surface removing substance and the panel.   
     
     
         2 . The method according to  claim 1 , wherein the step of printing is digitally controlled. 
     
     
         3 . The method according to  claim 1 , wherein the curable substance comprises wear resistant particles. 
     
     
         4 . The method according to  claim 1 , wherein the predefined pattern substantially corresponds to a decorative basic pattern being present on the panel. 
     
     
         5 . The method according to  claim 1 , wherein the curable substance or surface removing substance is printed onto the panel by first printing a liquid onto the panel in said predefined pattern, and then providing an intermediate substance to the liquid, wherein the intermediate substance or the liquid together with the intermediate substance form the curable substance or surface removing substance. 
     
     
         6 . The method according to  claim 5 , wherein the intermediate substance contains wear resistant particles. 
     
     
         7 . The method according to  claim 5 , wherein the intermediate substance comprises a powder. 
     
     
         8 . The method according to  claim 1 , wherein the maximal thickness of the curable substance is between 20 and 250 μm. 
     
     
         9 . The method according to  claim 1 , wherein the curable substance is cured by means of UV radiation. 
     
     
         10 . The method according to  claim 1 , wherein the curable substance contains a varnish. 
     
     
         11 . The method according to  claim 1 , wherein the panel is a flexible sheet which is laminated to a substrate after printing the curable substance or surface removing substance thereon so as to form the floor board. 
     
     
         12 . A method of manufacturing a floor board, comprising the steps of:
 supplying a panel,   applying a curable substance or surface removing substance onto the panel in a predefined pattern for creating an elevation on the panel at the pattern or removing a portion of the surface of the panel at the pattern, respectively, wherein said substance is applied onto the panel by first putting a layer of said substance onto the panel and then creating the predefined pattern by pressing member into said substance, movable in a plane extending parallel to the panel so as to form said pattern,   curing the curable substance or removing any reaction products of the surface removing substance and the panel.   
     
     
         13 . A method of manufacturing a floor board, comprising the steps of:
 supplying a panel,   applying a curable substance or surface removing substance onto the panel in a predefined pattern for creating an elevation on the panel at the pattern or removing a portion of the surface of the panel at the pattern, respectively, wherein said substance is applied onto the panel by first putting a layer of said substance onto the panel and then creating the predefined pattern by removing portions of the substance at predefined locations so as to form said pattern,   curing the curable substance or removing any reaction products of the surface removing substance and the panel.   
     
     
         14 . The method according to  claim 13 , wherein a surface removing substance onto the panel is printed in a predefined pattern for removing a portion of the surface of the panel at the pattern, and wherein the surface removing substance is activated by an activation device for reaction of the substance with the panel surface, after which any reaction products of the surface removing substance and the panel is removed. 
     
     
         15 . The method according to  claim 14 , wherein the activation device is formed by a laser device. 
     
     
         16 . The method according to  claim 1 , wherein the maximal thickness of the curable substance is between 5 and 1000 μm.