Spiral staircase shaped stacked semiconductor package and method for manufacturing the same

Abstract

A spiral staircase shaped stacked semiconductor package is presented. The package includes a semiconductor chip module, a substrate and connection members. The semiconductor chip module includes at least two semiconductor chips which have chip selection pads and through-electrodes. The semiconductor chips are stacked such that the chip selection pads are exposed and the through-electrodes of the stacked semiconductor chips are electrically connected to one another. The substrate has the semiconductor chip module mounted thereto and has connection pads. The connection members electrically connect the chip selection pads to respective connection pads.

1 . A method for manufacturing a stack package, comprising the steps of:
 preparing semiconductor chips, each semiconductor chip having an upper surface and a lower surface facing away from the upper surface and having at least one chip selection pad disposed adjacent to at least one corner of each corresponding semiconductor chip and having through-electrodes which pass through the upper surface and the lower surface of each corresponding semiconductor chip;   forming a semiconductor chip module by stacking at least two semiconductor chips together such that chip selection pads of the semiconductor chips are exposed and so that the through-electrodes of the stacked semiconductor chips are electrically connected respectively to each other; and   mounting the semiconductor chip module onto a substrate which has connection pads.   
     
     
         2 . The method according to  claim 1 , wherein the step of mounting the semiconductor chip module onto the substrate comprises the step of:
 bonding together, using conductive wires, chip selection pads of the stacked semiconductor chips to respective connection pads of the substrate.   
     
     
         3 . The method according to  claim 1 ,
 wherein the step of preparing the semiconductor chips further comprises the step of:   forming additional through-electrodes which pass through the chip selection pads; and   wherein the step of mounting the semiconductor chip module onto the substrate comprises the step of:   electrically connecting together, using conductive members, the additional through-electrodes to extensions which extend from the connection pads of the substrate to portions facing the additional through-electrodes, in which of the conductive members have spherical or column shapes.