Disguising test pads in a semiconductor package

Abstract

A method of forming a semiconductor package is disclosed including disguising the test pads. Test pads are defined in the conductive pattern of the semiconductor package for allowing electrical test of the completed package. The test pads are formed in shapes such as letters or objects so that they are less recognizable as test pads.

1 . A semiconductor package, comprising:
 a substrate having a conductive pattern, the conductive pattern including test pads for allowing electrical test of the semiconductor package, the test pads shaped into a shape that reduces a likelihood that the test pads are recognizable as test pads;   one or more semiconductor die coupled to the substrate; and   molding compound encapsulating the one or more semiconductor die and at least a portion of the substrate.   
     
     
         2 . A semiconductor package as recited in  claim 1 , further comprising a cover for covering the test pads. 
     
     
         3 . A semiconductor package as recited in  claim 1 , wherein the test pads are shaped as text. 
     
     
         4 . A semiconductor package as recited in  claim 1 , wherein a plurality of the test pads together form the shape of a letter. 
     
     
         5 . A semiconductor package as recited in  claim 1 , wherein a plurality of the test pads together form the shape of an object. 
     
     
         6 . A semiconductor package as recited in  claim 1 , wherein the semiconductor package is one of a microSD card, CompactFlash, SmartMedia, MMCc card, SD card, miniSD card and xD card. 
     
     
         7 . A semiconductor package, comprising:
 a substrate having a conductive pattern, the conductive pattern including test pads for allowing electrical test of the semiconductor package, the test pads shaped into letters and/or an object for disguising the test pads;   one or more semiconductor die coupled to the substrate; and   molding compound encapsulating the one or more semiconductor die and at least a portion of the substrate.   
     
     
         8 . A semiconductor package as recited in  claim 7 , wherein a single test pad forms the shape of a single letter. 
     
     
         9 . A semiconductor package as recited in  claim 7 , wherein a plurality of the test pads together form the shape of a letter. 
     
     
         10 . A semiconductor package as recited in  claim 7 , wherein the test pads spell at least a portion of a company name, the name of the semiconductor package or a brand. 
     
     
         11 . A semiconductor package as recited in  claim 7 , wherein a plurality of the test pads together form the shape of an object. 
     
     
         12 . A semiconductor package as recited in  claim 1 , wherein the semiconductor package is one of a microSD card, CompactFlash, SmartMedia, MMCc card, SD card, miniSD card and xD card.