Method of fabricating circuit board

Abstract

A method of fabricating a circuit board including at least one insulation layer and at least one wiring layer, the method including a first step of forming a wiring trench in a surface of the insulation layer, a second step of forming a conductor layer serving as the wiring layer in the wiring trench such that at least a portion of the conductor layer is embedded in the wiring trench, and a third step of cutting a surface of the conductor layer with a cutting tool to form the wiring layer.

1 . A method of fabricating a circuit board including at least one insulation layer and at least one wiring layer, the method comprising:
 a first step of forming a wiring trench in a surface of said insulation layer;   a second step of forming a conductor layer serving as the wiring layer in said wiring trench such that at least a portion of said conductor layer is embedded in said wiring trench; and   a third step of cutting a surface of said conductor layer with a cutting tool to form said wiring layer.   
     
     
         2 . The method as claimed in  claim 1 , wherein said cutting tool used in said third step is a diamond bite. 
     
     
         3 . The method as claimed in  claim 1 , wherein in said third step, the surface of said conductor layer as well as the surface of said insulation layer are cut to form a roughened surface on said insulation layer. 
     
     
         4 . The method as claimed in  claim 1 , wherein in said third step, the cutting operation is carried out plural times in a plurality of stages. 
     
     
         5 . The method as claimed in  claim 1 , wherein said second step further comprises:
 a step of forming a first conductor layer in said wiring trench by electroless plating; and   a step of forming a second conductor layer on the first conductor layer by electroplating.