Cooling system for electronic device
Abstract
A cooling system for cooling an electronic device includes a first heat exchanger, a second heat exchanger, a first refrigerant pipe, a second refrigerant pipe, and a pump. The first and second refrigerant pipes receive refrigerants, which can circulate in the first and second heat exchangers. The first heat exchanger is arranged in the electronic device for cooling the electronic device. The second heat exchanger cools the refrigerants by gasifying liquefied gas. The pump circulates the refrigerants. The third heat exchanger heats the liquefied gas with sea water before the liquefied gas enters the second heat exchanger.
Claims
exact text as granted — not AI-modified1 . A cooling system for an electronic device, the cooling system comprising:
a first heat exchanger for being arranged in the electronic device for cooling the electronic device; a second heat exchanger; a third heat exchanger; a pump connected to the second heat exchanger; a first refrigerant pipe connected between the first heat exchanger and the pump; and a second refrigerant pipe connected between the first heat exchanger and the second heat exchanger; wherein the first heat exchanger, the second refrigerant pipe, the second heat exchanger, the pump, and the first refrigerant pipe together form a circulatory system and circulates refrigerants; wherein the first refrigerant pipe transfers refrigerants cooled by the second heat exchanger into the first heat exchanger, to cool the first heat exchanger; wherein the second refrigerant pipe transfers refrigerants heated by the first heat exchanger into the second heat exchanger; wherein the pump circulates refrigerants; wherein the second heat exchanger cools the refrigerants flowing through the second heat exchanger through gasification of liquefied gas; and wherein the third heat exchanger heats the liquefied gas with sea water before the liquefied gas enters the second heat exchanger.
2 . The cooling system of claim 1 , wherein the liquefied gas is liquefied natural gas.
3 . The cooling system of claim 1 , wherein the liquefied gas is liquid nitrogen.
4 . The cooling system of claim 1 , wherein the second heat exchanger receives heat medium for transferring heat of the heated refrigerants to the liquefied gas.
5 . The cooling system of claim 4 , wherein the heat medium is antifreeze.
6 . The cooling system of claim 1 , wherein the second heat exchanger is a shell and tube heat exchanger or a plate heat exchanger.Join the waitlist — get patent alerts
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