Apparatus for detecting pattern alignment error

Abstract

An apparatus for detecting pattern alignment error includes a first conductive pattern disposed over a first insulation member with a power source applied of the first conductive pattern; a second insulation member for covering the first conductive pattern; a second conductive pattern disposed on the second insulation member; a conductive via connected to the second conductive pattern and passing through the second insulation member; and an insulation pattern disposed in the first to conductive pattern for detecting an alignment error in response to a position of the conductive via. The apparatus for detecting pattern alignment error can detect the alignment of lower wiring in a device with multi-layer wiring

1 . A method for a detecting whether or not a pattern alignment error exists by using an apparatus in a printed circuit board, the apparatus comprising: a first conductive pattern disposed over a first insulation member; a second insulation member covering the first conductive pattern; a second conductive pattern disposed on the second insulation layer; a conductive via electrically connected to the second conductive pattern and passing through the second insulation member; and an insulation pattern disposed in the first conductive pattern, the method comprising:
 applying a power source to the first conductive pattern; and   measuring a voltage at the second conductive pattern to detect whether or not the pattern alignment error exists.   
     
     
         2 . The method of  claim 1 , wherein when the measured voltage corresponds to the power source then the pattern alignment error is determined to exist. 
     
     
         3 . The method of  claim 1 , wherein when the measured voltage does not correspond to the power source then the pattern alignment error is determined not to exist.