Circuit substrate

Abstract

A circuit substrate having a base layer, a patterned conductive layer, a dielectric layer and a conductive block is provided. The patterned conductive layer is disposed on the base layer and having an inner pad. The dielectric layer is disposed on the base layer and covering the patterned conductive layer. The conductive block penetrates the dielectric layer, the conductive block being substantially coplanar with the dielectric layer and connecting the inner pad.

1 . A circuit substrate, comprising:
 a base layer;   a patterned conductive layer disposed on the base layer and having an inner pad;   a dielectric layer disposed on the base layer and covering the patterned conductive layer; and   a conductive block penetrating the dielectric layer, the conductive block being substantially coplanar with the dielectric layer and connecting the inner pad.   
     
     
         2 . The circuit substrate as claimed in  claim 1 , further comprising:
 a surface passivation layer disposed on the conductive block.   
     
     
         3 . The circuit substrate as claimed in  claim 1 , wherein an outer diameter of the inner pad is greater than an outer diameter of the conductive block such that the inner pad and the conductive block together form a structure having a cross-section in an inverted-T-shape profile. 
     
     
         4 . The circuit substrate as claimed in  claim 1 , wherein an outer diameter of the inner pad is smaller than an outer diameter of the conductive block such that the conductive block encompasses the inner pad. 
     
     
         5 . The circuit substrate as claimed in  claim 1 , wherein the patterned conductive layer further has an inner trace, and an end portion of the inner trace forms the inner pad.