Cooling system for electronic device

Abstract

A cooling system for cooling an electronic device includes a first heat exchanger, a second heat exchanger, a first refrigerant pipe, a second refrigerant pipe, and a pump. The first and second refrigerant pipes receive refrigerants, which can circulate in the first and second heat exchangers. The first heat exchanger is arranged in the electronic device for cooling the electronic device. The second heat exchanger is used for cooling the refrigerants by gasifying liquefied gas. The pump is used for circulating the refrigerants.

1 . A cooling system for an electronic device, comprising:
 a first heat exchanger for cooling the electronic device;   a second heat exchanger;   a pump connected to the second heat exchanger;   a first refrigerant pipe connected between the first heat exchanger and the pump; and   a second refrigerant pipe connected between the first heat exchanger and the second heat exchanger;   wherein the first heat exchanger, the second refrigerant pipe, the second heat exchanger, the pump, and the first refrigerant pipe together form a circulatory system for receiving refrigerants;   wherein the first refrigerant pipe is used for transferring refrigerants cooled by the second heat exchanger into the first heat exchanger, to cool the first heat exchanger;   wherein the second refrigerant pipe is used for transferring refrigerants heated by the first heat exchanger into the second heat exchanger;   wherein the pump is used for circulating refrigerants; and   wherein the second heat exchanger is used for cooling the refrigerants flowing through the second heat exchanger through gasification of liquefied gas.   
     
     
         2 . The cooling system of  claim 1 , wherein the liquefied gas is liquefied natural gas. 
     
     
         3 . The cooling system of  claim 1 , wherein the liquefied gas is liquid nitrogen. 
     
     
         4 . The cooling system of  claim 1 , wherein the second heat exchanger receives heat medium for transferring heat of the heated refrigerants to the liquefied gas. 
     
     
         5 . The cooling system of  claim 4 , wherein the heat medium is antifreeze.