Heat dissipation device with heat pipe within base

Abstract

A heat dissipation device includes a base, at least one heat pipe, and a fin assembly. The base is substantially planar. The base includes a first interface and a second interface opposite to the first interface. The first interface is adapted to contact a heat element. The base defines a slot at the second interface. The at least one heat pipe is received in the slot. The fin assembly contacts the second interface and the at least one heat pipe simultaneously.

1 . A heat dissipation device comprising:
 a base, the base being substantially planar, the base comprising a first interface and a second interface opposite to the first interface, the first interface being configured to contact a heat element, and the base defining a slot at the second interface;   at least one heat pipe received in the slot; and   a fin assembly contacting the second interface and the at least one heat pipe simultaneously.   
     
     
         2 . The heat dissipation device of  claim 1 , wherein an interface between the at least one heat pipe and the fin assembly is substantially flushed with the second interface. 
     
     
         3 . The heat dissipation device of  claim 1 , wherein a depth of the slot is less than a thickness of the base. 
     
     
         4 . The heat dissipation device of  claim 1 , wherein the at least one heat pipe is located substantially within the base. 
     
     
         5 . The heat dissipation device of  claim 1 , wherein the at least one heat pipe extends within an extension plane substantially parallel to a plane of the second interface. 
     
     
         6 . The heat dissipation device of  claim 1 , wherein the base comprises a thermal contact area and two through openings at opposite sides of the thermal contact area, the thermal contact area is configured to contact the heat element. 
     
     
         7 . The heat dissipation device of  claim 6 , wherein the at least one heat pipe comprises a first heat pipe and two second heat pipes, the first heat pipe is substantially Z shaped, and each of the two heat pipes is substantially L shaped. 
     
     
         8 . The heat dissipation device of  claim 7 , wherein the first heat pipe comprises a first main portion and two first extension portions, each of the two first extension portions is connected to each opposite side of the first main portion, the first main portion is located at the thermal contact area, and each of the two first extension portions extends out from the thermal contact area. 
     
     
         9 . The heat dissipation device of  claim 7 , wherein each of the two second pipes comprises a second main portion and a second extension portion, the second main portion is located at the thermal contact area, and the second extension portion extends around each of the two through openings. 
     
     
         10 . The heat dissipation device of  claim 7 , wherein the two second heat pipes are symmetrical about a central point of the base. 
     
     
         11 . The heat dissipation device of  claim 1 , wherein a weight-to-volume density of the at least one heat pipe is larger than a weight-to-volume density of the base. 
     
     
         12 . The heat dissipation device of  claim 11 , wherein the at least one heat pipe comprises copper, and the base comprises aluminum. 
     
     
         13 . A heat dissipation device comprising:
 a base, the base being substantially planar, the base comprising a first interface and a second interface opposite to the first interface, the first interface being configured to contact a heat element, and the base defining a slot at the second interface;   at least one heat pipe received in the slot and located substantially within the base; and   a fin assembly contacting the second interface.   
     
     
         14 . The heat dissipation device of  claim 13 , wherein an interface between the at least one heat pipe and the fin assembly is substantially flushed with the second interface. 
     
     
         15 . The heat dissipation device of  claim 13 , wherein a depth of the slot is less than a thickness of the base. 
     
     
         16 . The heat dissipation device of  claim 13 , wherein the fin assembly contacting the second interface and the at least one heat pipe simultaneously. 
     
     
         17 . The heat dissipation device of  claim 13 , wherein the base comprises a thermal contact area and two through openings at opposite sides of the thermal contact area, the thermal contact area is configured to contact the heat element. 
     
     
         18 . The heat dissipation device of  claim 17 , wherein the at least one heat pipe comprises a first heat pipe and two second heat pipes, the first heat pipe is substantially Z shaped, and each of the two heat pipes is substantially L shaped. 
     
     
         19 . The heat dissipation device of  claim 17 , wherein the first heat pipe comprises a first main portion and two first extension portions, each of the tow first extension portions is connected to each opposite side of the first main portion, the first main portion is located at the thermal contact area, and each of the two first extension portions extends out from the thermal contact area. 
     
     
         20 . The heat dissipation device of  claim 17 , wherein each of the two second pipes comprises a second main portion and a second extension portion, the second main portion is located at the thermal contact area, and the second extension portion extends around each of the through openings.