Reinforcing sheet for resin molded article, reinforced structure of resin molded article, and reinforcing method
Abstract
A reinforcing sheet for a resin molded article includes a constraining layer and a reinforcing layer laminated on the constraining layer. When the reinforcing sheet for a resin molded article is attached to a polypropylene plate having a thickness of 2.0 mm and is heated at 80° C. for 10 minutes, the bending strength at a displacement of 1 mm of the resulting sheet after the heating is 3 N or more and the maximum bending strength thereof is 30 N or more, and a high-temperature adhesion retention ratio R as determined by the following formula is 80% or more. High-temperature adhesion retention ratio R=(Adhesive force A1000h after heating at 100° C. for 1000 hours/Adhesive force A1h after heating at 100° C. for 1 hour)×100.
Claims
exact text as granted — not AI-modified1 . A reinforcing sheet for a resin molded article comprising:
a constraining layer and a reinforcing layer laminated on the constraining layer, wherein when the reinforcing sheet for a resin molded article is attached to a polypropylene plate having a thickness of 2.0 mm and is heated at 80° C. for 10 minutes, the bending strength at a displacement of 1 mm of the resulting sheet after the heating is 3 N or more and the maximum bending strength thereof is 30 N or more, and a high-temperature adhesion retention ratio R as determined by the following formula is 80% or more.
High-temperature adhesion retention ratio R =(Adhesive force A 1000h after heating at 100° C. for 1000 hours/Adhesive force A 1h after heating at 100° C. for 1 hour)×100
Adhesive force A 1000h after heating at 100° C. for 1000 hours: the adhesive force with respect to a polypropylene plate, which is obtained by attaching the reinforcing layer to the polypropylene plate to be heated at 80° C. for 10 minutes and then heated at 100° C. for 1000 hours to be thereafter measured by a 90-degree peeling test based on JIS Z0237 (in 2000) at a peeling rate of 300 mm/min. Adhesive force A 1h after heating at 100° C. for 1 hour: the adhesive force with respect to a polypropylene plate, which is obtained by attaching the reinforcing layer to the polypropylene plate to be heated at 80° C. for 10 minutes and then heated at 100° C. for 1 hour to be thereafter measured by a 90-degree peeling test based on JIS Z0237 (in 2000) at a peeling rate of 300 mm/min.
2 . The reinforcing sheet for a resin molded article according to claim 1 , wherein
an adhesive force A 10m with respect to a polypropylene plate, which is obtained by attaching the reinforcing layer to the polypropylene plate to be heated at 80° C. for 10 minutes to be thereafter measured by a 90-degree peeling test based on JIS Z0237 (in 2000) at a peeling rate of 300 mm/min, is 15 N/25 mm or more.
3 . The reinforcing sheet for a resin molded article according to claim 1 , wherein
the adhesive force A 1h after heating at 100° C. for 1 hour is 50 N/25 mm or more.
4 . The reinforcing sheet for a resin molded article according to claim 1 , wherein
the storage elastic modulus of the reinforcing layer at 25° C. is 500 kPa or more and that at 80° C. is 500 kPa or less.
5 . The reinforcing sheet for a resin molded article according to claim 1 , wherein
an adhesive force A 0 at the time of normal temperature with respect to a polypropylene plate, which is measured by a 90-degree peeling test based on JIS Z0237 (in 2000) at a peeling rate of 300 mm/min, is 0.3 N/25 mm or more.
6 . The reinforcing sheet for a resin molded article according to claim 1 , wherein
the reinforcing layer is formed of a thermally adhesive type adhesive composition.
7 . The reinforcing sheet for a resin molded article according to claim 6 , wherein
the adhesive composition contains a hydrogenated polymer of a monomer containing conjugated dienes.
8 . The reinforcing sheet for a resin molded article according to claim 7 , wherein
the adhesive composition further contains a tackifier.
9 . The reinforcing sheet for a resin molded article according to claim 8 , wherein
the tackifier contains an alicyclic saturated hydrocarbon resin.
10 . The reinforcing sheet for a resin molded article according to claim 9 , wherein
the tackifier further contains a terpene resin.
11 . The reinforcing sheet for a resin molded article according to claim 8 , wherein
the mixing ratio of the tackifier is 40 to 200 parts by weight with respect to 100 parts by weight of the hydrogenated polymer.
12 . A reinforced structure of a resin molded article comprising:
a reinforcement of a resin molded article obtained by attaching a reinforcing sheet for a resin molded article including a constraining layer and a reinforcing layer laminated on the constraining layer to the resin molded article to be then heated at 80° C. or more to bring the reinforcing sheet for a resin molded article into close contact with the resin molded article, wherein when the reinforcing sheet for a resin molded article is attached to a polypropylene plate having a thickness of 2.0 mm and is heated at 80° C. for 10 minutes, the bending strength at a displacement of 1 mm of the resulting sheet after the heating is 3 N or more and the maximum bending strength thereof is 30 N or more, and a high-temperature adhesion retention ratio R as determined by the following formula is 80% or more.
High-temperature adhesion retention ratio R =(Adhesive force A 1000h after heating at 100° C. for 1000 hours/Adhesive force A 1h after heating at 100° C. for 1 hour)×100
Adhesive force A 1000h after heating at 100° C. for 1000 hours: the adhesive force with respect to a polypropylene plate, which is obtained by attaching the reinforcing layer to the polypropylene plate to be heated at 80° C. for 10 minutes and then heated at 100° C. for 1000 hours to be thereafter measured by a 90-degree peeling test based on JIS Z0237 (in 2000) at a peeling rate of 300 mm/min. Adhesive force A 1h after heating at 100° C. for 1 hour: the adhesive force with respect to a polypropylene plate, which is obtained by attaching the reinforcing layer to the polypropylene plate to be heated at 80° C. for 10 minutes and then heated at 100° C. for 1 hour to be thereafter measured by a 90-degree peeling test based on JIS Z0237 (in 2000) at a peeling rate of 300 mm/min.
13 . The reinforced structure of the resin molded article according to claim 12 , wherein
the reinforcing sheet for a resin molded article is heated at 80° C. or more in advance and then, the reinforcing sheet for a resin molded article is attached to the resin molded article.
14 . A reinforcing method of a resin molded article comprising the steps of:
attaching a reinforcing sheet for a resin molded article including a constraining layer and a reinforcing layer laminated on the constraining layer to the resin molded article and reinforcing the resin molded article by heating the reinforcing sheet for a resin molded article and/or the resin molded article at 80° C. or more to bring the reinforcing sheet for a resin molded article into close contact with the resin molded article, wherein when the reinforcing sheet for a resin molded article is attached to a polypropylene plate having a thickness of 2.0 mm and is heated at 80° C. for 10 minutes, the bending strength at a displacement of 1 mm of the resulting sheet after the heating is 3 N or more and the maximum bending strength thereof is 30 N or more, and a high-temperature adhesion retention ratio R as determined by the following formula is 80% or more.
High-temperature adhesion retention ratio R =(Adhesive force A 1000h after heating at 100° C. for 1000 hours/Adhesive force A 1h after heating at 100° C. for 1 hour)×100
Adhesive force A 1000h after heating at 100° C. for 1000 hours: the adhesive force with respect to a polypropylene plate, which is obtained by attaching the reinforcing layer to the polypropylene plate to be heated at 80° C. for 10 minutes and then heated at 100° C. for 1000 hours to be thereafter measured by a 90-degree peeling test based on JIS Z0237 (in 2000) at a peeling rate of 300 mm/min. Adhesive force A 1h after heating at 100° C. for 1 hour: the adhesive force with respect to a polypropylene plate, which is obtained by attaching the reinforcing layer to the polypropylene plate to be heated at 80° C. for 10 minutes and then heated at 100° C. for 1 hour to be thereafter measured by a 90-degree peeling test based on JIS Z0237 (in 2000) at a peeling rate of 300 mm/min.
15 . The reinforcing method of the resin molded article according to claim 14 , wherein
in the step of attaching the reinforcing sheet for a resin molded article to the resin molded article, the reinforcing sheet for a resin molded article is heated at 80° C. or more in advance and then, the reinforcing sheet for a resin molded article is attached to the resin molded article.Join the waitlist — get patent alerts
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