Nitride-based semiconductor device and method for fabricating the same
Abstract
A nitride-based semiconductor light-emitting device 100 includes a GaN substrate 10 , of which the principal surface is an m-plane 12 , a semiconductor multilayer structure 20 that has been formed on the m-plane 12 of the GaN-based substrate 10 , and an electrode 30 arranged on the semiconductor multilayer structure 20 . The electrode 30 includes an Mg alloy layer 32 which is formed of Mg and a metal that makes an alloy with Mg less easily than Au. The Mg alloy layer 32 is in contact with a surface of a p-type semiconductor region of the semiconductor multilayer structure 20.
Claims
exact text as granted — not AI-modified1 . A nitride-based semiconductor device, comprising:
a nitride-based semiconductor multilayer structure including a p-type GaN based semiconductor region, a surface of the p-type GaN based semiconductor region being an m-plane; and an electrode that is arranged on the p-type GaN based semiconductor region, wherein the p-type GaN based semiconductor region is made of an Al x In y Ga z N semiconductor (where x+y+z=1, x≧0, y≧0, and z>0), and the electrode includes a Mg alloy layer which is in contact with the surface of the p-type GaN based semiconductor region and which is made from Mg and a metal that makes an alloy with Mg less easily than Au.
2 . The nitride-based semiconductor device of claim 1 , wherein a contact resistance of the electrode arranged on the m-plane is less than 1.0×10 −02 Ωcm 2 .
3 . The nitride-based semiconductor device of claim 1 , wherein
the electrode includes the Mg alloy layer and a metal layer provided directly on the Mg alloy layer, and the metal layer is formed of a metal that makes an alloy with Mg less easily than Au.
4 . The nitride-based semiconductor device of claim 3 , wherein a thickness of the Mg alloy layer is equal to or smaller than a thickness of the metal layer.
5 . The nitride-based semiconductor device of claim 1 , wherein the semiconductor multilayer structure includes an active layer which includes an Al a In b Ga c N layer (where a+b+c=1, a≧0, b≧0 and c≧0), the active layer being configured to emit light.
6 . The nitride-based semiconductor device of claim 1 , wherein the Mg alloy layer has a thickness of 0.1 nm to 5 nm.
7 . The nitride-based semiconductor device of claim 1 , wherein, in the Mg alloy layer, a concentration of N is lower than a concentration of Ga.
8 . The nitride-based semiconductor device of claim 1 , further comprising a semiconductor substrate that supports the semiconductor multilayer structure.
9 . A light source, comprising:
the nitride-based semiconductor device according to claim 1 ; and a wavelength converter including a phosphor that converts a wavelength of light emitted from the nitride-based semiconductor device.
10 . A nitride-based semiconductor device, comprising:
a nitride-based semiconductor multilayer structure including a p-type GaN based semiconductor region, a surface of the p-type GaN based semiconductor region being an m-plane; and an electrode that is arranged on the p-type GaN based semiconductor region, wherein the p-type GaN based semiconductor region is made of an Al x In y Ga z N semiconductor (where x+y+z=1, x≧0, y≧0, and z>0), and the electrode includes Mg alloy islands provided on the surface of the p-type GaN based semiconductor region, the Mg alloy islands being made from Mg and a metal that makes an alloy with Mg less easily than Au.
11 . The nitride-based semiconductor device of claim 10 , wherein a contact resistance of the electrode arranged on the m-plane is less than 1.0×10 −02 Ωcm 2 .
12 . The nitride-based semiconductor device of claim 10 , wherein
the electrode includes the Mg alloy islands and a metal layer provided directly on the Mg alloy islands, and the metal layer is formed of a metal that makes an alloy with Mg less easily than Au.Join the waitlist — get patent alerts
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