Cooling Assembly for Cooling Heat Generating Component

Abstract

A cooling assembly for cooling of a heat generating component ( 5 ) is provided. The cooling assembly comprises a heat sink ( 1 ) and at least one thermally conductive plate ( 2 ) attached to one side of the heat sink, where the plate is adapted to be in direct thermal contact with the heat generating component. The cooling assembly comprises at least one elongated heat conductor ( 3 ), which at least partly is embedded into the heat sink. The cooling assembly also comprises a plurality of fins ( 4 ) protruding from the heat sink. In the cooling assembly, the plate is at least partly embedded into the heat sink, and at least one of the heat conductors is adapted to be in direct thermal contact with the heat generating component.

1 - 20 . (canceled) 
     
     
         21 . A cooling assembly for cooling a heat generating component, comprising:
 a heat sink having a first side adapted to face the heat generating component, and a second side that is opposite the first side;   at least one thermally conductive plate attached to and at least partially embedded into the first side of the heat sink, wherein the plate is adapted to be in direct thermal contact with the heat generating component;   a first heat conductor having an elongated shape, wherein the first heat conductor is at least partly embedded into the first side of the heat sink;   a plurality of fins protruding from the second side of the heat sink;   wherein the first heat conductor is adapted to be in direct thermal contact with the heat generating component.   
     
     
         22 . The cooling assembly of  claim 21  wherein the first heat conductor is a heat pipe. 
     
     
         23 . The cooling assembly of  claim 21  wherein the heat sink has a non uniform thickness. 
     
     
         24 . The cooling assembly of  claim 21  wherein the heat sink has a first region that has a greater thickness than a second region of the heat sink; wherein the plate is disposed in the first region. 
     
     
         25 . The cooling assembly of  claim 24  wherein the first region of the heat sink extends between two opposite substantially parallel edges of the heat sink. 
     
     
         26 . The cooling assembly of  claim 25  wherein a thickness of the heat sink decreases continuously from the first region to the second region in a direction parallel to the two opposite edges. 
     
     
         27 . The cooling assembly of  claim 21  wherein at least a part of the first heat conductor is embedded into the plate. 
     
     
         28 . The cooling assembly of  claim 21  wherein the fins extend between two opposite substantially parallel edges of the heat sink. 
     
     
         29 . The cooling assembly of  claim 21  wherein the fins are spaced apart at a distance of approximately 10 to 14 millimeters. 
     
     
         30 . The cooling assembly of  claim 21  wherein the plate has a greater area than the heat generating component. 
     
     
         31 . The cooling assembly of  claim 21  wherein the plate is made of copper. 
     
     
         32 . The cooling assembly of  claim 21  wherein the heat sink is made of aluminum or magnesium. 
     
     
         33 . A method of manufacturing a cooling assembly, comprising:
 providing a heat sink having a first side and an opposite second side, and having a plurality of fins protruding from the second side;   embedding a plate into the first side of the heat sink;   providing elongated grooves on the first side of the heat sink;   inserting elongated heat conductors into the grooves;   attaching the heat conductors to the grooves of the heat sink;   filling gaps in the grooves of the heat sink around the heat conductors with a bonding material; and   machining a surface of the first side of the heat sink.   
     
     
         34 . The method of  claim 33  further comprising attaching a heat generating component to the cooling assembly so that the heat generating component is in direct thermal contact with the plate and the heat conductors. 
     
     
         35 . The method of  claim 33  wherein the heat conductors are attached to the heat sink by welding. 
     
     
         36 . The method of  claim 33  wherein the bonding material is solder.