Modular chip stack and packaging technology with voltage segmentation, regulation, integrated decoupling capacitance, and cooling structure and process

Abstract

An electronic apparatus includes an electronic component electrically connected to a substrate positioned beneath the electronic component. A member includes a plurality of decoupling capacitors having different voltages, and the decoupling capacitors are electrically connected to the electronic component. A plurality of voltage planes in the member are electrically connected to the decoupling capacitors. The decoupling capacitors, via the voltage planes in the member, provide different voltages to the voltage planes and thus the electronic component.

1 . A method for supplying a specified voltage to an electronic component, comprising:
 electrically connecting a plurality of electronic components to at least one substrate;   electrically connecting a plurality of members to at least one of the plurality of electronic components;   providing decoupling capacitors in each of the members, and each of the decoupling capacitors supporting one or more different voltage levels;   electrically connecting each of the decoupling capacitors to selected electronic components; and   supplying a specified voltage to the electronic components using corresponding decoupling capacitors.   
     
     
         2 . The method of  claim 1  further including:
 supporting or supplying different voltages from the decoupling capacitors to one electronic component using a low inductance path. 
 
     
     
         3 . The method of  claim 1  further including:
 supporting or supplying different voltages from the decoupling capacitors to a plurality of electronic components.