US2013000963A1PendingUtilityA1

Micro pin hybrid interconnect array

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Assignee: GEN ELECTRICPriority: Apr 19, 2010Filed: Sep 14, 2012Published: Jan 3, 2013
Est. expiryApr 19, 2030(~3.7 yrs left)· nominal 20-yr term from priority
Inventors:Charles Gerard WoychickJohn Eric TkaczykBrian David YanoffTan Zhang
H10P 74/23H10W 90/724H10W 74/15H10W 74/012H10W 72/9415H10W 72/07338H10W 72/07254H10W 72/07252H10W 72/07236H10W 72/07232H10W 72/07231H10W 72/07223H10W 72/07221H10W 72/01971H10W 72/01271H10W 72/01225H10W 72/952H10W 72/923H10W 72/354H10W 72/252H10W 72/251H10W 72/248H10W 72/247H10W 72/244H10W 72/241H10W 72/221H10W 72/90H10W 72/074H10W 72/073H10W 72/29H10W 72/012H10W 42/121H10W 72/072H10W 72/019H10W 72/20Y10T29/49162Y10T29/49179Y10T29/49144Y10T29/49155Y10T29/49139Y10T29/4913H10F 39/811H10F 39/804
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Claims

Abstract

A micro pin hybrid interconnect array includes a crystal anode array and a ceramic substrate. The array and substrate are joined together using an interconnect geometry having a large aspect ratio of height to width. The joint affixing the interconnect to the crystal anode array is devoid of solder.

Claims

exact text as granted — not AI-modified
1 . A micro pin hybrid interconnect array comprising a crystal anode array and a ceramic substrate, the array and substrate joined together via an interconnect geometry having a large aspect ratio of height to width greater than one, wherein the joint affixing the interconnect to the crystal anode array is devoid of solder. 
     
     
         2 . The micro pin hybrid interconnect array according to  claim 1 , wherein the interconnect comprises at least one of a copper pillar, a gold stud bump, a gold plated pillar, and combinations thereof. 
     
     
         3 . The micro pin hybrid interconnect array according to  claim 1 , wherein the joint affixing the interconnect to the crystal anode array comprises a single substantially planar unitary solderable under bump metallization structure. 
     
     
         4 . The micro pin hybrid interconnect array according to  claim 1 , wherein the joint affixing the interconnect to the substrate comprises at least one of a solder joint, a compression bond joint, an adhesive epoxy joint, and combinations thereof. 
     
     
         5 . A micro pin hybrid interconnect array comprising a crystal anode array and a ceramic substrate, the array and substrate joined together via a compliant micro pin hybrid interconnect configuration such that mechanical strains between the array and the interconnect during temperature excursions remain below that achieved using solder bonding to join a crystal anode array to an interconnect to form a micro pin hybrid interconnect array. 
     
     
         6 . The micro pin hybrid interconnect array according to  claim 5 , wherein the interconnect comprises at least one of a copper pillar, a gold stud bump, a gold plated pillar, and combinations thereof. 
     
     
         7 . The micro pin hybrid interconnect array according to  claim 5 , wherein the joint affixing the interconnect to the crystal anode array comprises a single substantially planar unitary solderable under bump metallization structure. 
     
     
         8 . The micro pin hybrid interconnect array according to  claim 5 , wherein the joint affixing the interconnect to the substrate comprises at least one of a solder joint, a compression bond joint, an adhesive epoxy joint, and combinations thereof. 
     
     
         9 . The micro pin hybrid interconnect array according to  claim 5 , wherein the interconnect has a large aspect ratio of height to width greater than one.

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