Heat dissipation system
Abstract
An exemplary heat dissipation system includes a built-in heat dissipation module for being positioned in a computer case, a liquid pump communicating with the built-in heat dissipation module, and an add-on heat dissipation module for being positioned outside of the computer case. The built-in heat dissipation module includes cooling fluid. The add-on heat dissipation module includes a receiving frame and a heat dissipation device fixed to the receiving frame. The receiving frame engages with the heat dissipation device to receive the cooling fluid. The receiving frame communicates with the built-in heat dissipation module and the liquid pump, such that the cooling fluid can be circulated between the built-in heat dissipation module and the receiving frame under the control of the liquid pump.
Claims
exact text as granted — not AI-modified1 . A heat dissipation system comprising:
a built-in heat dissipation module for being positioned in a computer case, the built-in heat dissipation module comprising cooling fluid; a liquid pump communicating with the built-in heat dissipation module, and an add-on heat dissipation module for being positioned outside of the computer case, the add-on heat dissipation module comprising a receiving frame and a heat dissipation device fixed to the receiving frame, the receiving frame and the heat dissipation device cooperatively receiving the cooling fluid, the receiving frame communicating with the built-in heat dissipation module and the liquid pump, such that the cooling fluid can be circulated between the built-in heat dissipation module and the receiving frame under the control of the liquid pump.
2 . The heat dissipation system of claim 1 , wherein the heat dissipation device comprises a plurality of heat dissipation fins, a heat dissipation surface thermally coupled to the heat dissipation fins, a connecting surface opposite to the heat dissipation surface, and the connecting surface is thermally coupled to the receiving frame, and covers the receiving frame.
3 . The heat dissipation system of claim 2 , wherein the heat dissipation device further comprises a liquid filling hole passing through the heat dissipation surface and the connecting surface, and a sealing screw, the liquid filling hole communicates with the receiving frame, and the sealing screw engages with the liquid filling hole to seal the liquid filling hole.
4 . The heat dissipation system of claim 2 , wherein the add-on dissipation module further comprises a fan fixed on the heat dissipation fins.
5 . The heat dissipation system of claim 1 , wherein the built-in heat dissipation module comprises a first liquid inlet and a first liquid outlet, the liquid pump comprises a second liquid inlet and a second liquid outlet, the second liquid outlet communicates with the first liquid outlet, and the receiving frame communicates with the first liquid outlet and the second liquid inlet.
6 . The heat dissipation system of claim 5 , wherein the receiving frame comprises a runner, one end of the runner communicates with the first liquid outlet, and the other end of the runner communicates with the second liquid inlet.
7 . The heat dissipation system of claim 6 , wherein the receiving frame comprises a first through hole and a second through hole, one end of the runner communicates with the first liquid outlet via the first through hole, and the other end of the runner communicates with the second liquid inlet via the second through hole.
8 . The heat dissipation system of claim 6 , further comprising two hollow tubes and two connector heads, the built-in heat dissipation module and the liquid pump being communicated between the first through hole and the second through hole by the two hollow tubes, the first through hole and the second through hole communicating with the respective hollow tubes by the respective connector heads, each of the connector heads comprising a hollow screw and a nut, one end of each hollow screw being connected to a respective one of the first and second through holes, and the other end of each hollow screw being connected to one of the nuts.
9 . The heat dissipation system of claim 6 , wherein the receiving frame comprises a bottom plate and a sidewall protruding from and surrounding the bottom plate, the first through hole and the second through hole are defined in the bottom plate.
10 . The heat dissipation system of claim 9 , wherein the runner comprises a plurality of parallel and spaced strips protruding from the bottom plate.Join the waitlist — get patent alerts
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