Multi-channel de-applicator

Abstract

An apparatus to clean an electronic device may include a head structure having a first surface adapted to face a body to be cleaned, and a plurality of supply openings and return openings on the first surface. At least a portion of the supply openings and return openings are positioned as alternating rows of supply openings and return openings. The supply openings are larger in area than the return openings in at least a majority of the alternating rows. The supply openings and the return openings are adapted to transmit at least one of a gas and a liquid therethrough. The head structure is adapted to permit the transmission of at least one of a gas and a liquid through the supply openings and at the same time the head structure is also adapted to permit the transmission of at least one of a gas and a liquid through the return openings. Other embodiments are described and claimed.

1 . An apparatus to clean an electronic device comprising:
 a head structure including a first surface adapted to face a body to be cleaned;   a plurality of supply openings and a plurality of return openings on the first surface;   at least a portion of the supply openings and return openings positioned as alternating rows of supply openings and return openings on the first surface;   the supply openings being larger in area than the return openings in at least a majority of the alternating rows of supply openings and return openings;   wherein the supply openings are adapted to transmit at least one of a gas and a liquid therethrough;   wherein the return openings are adapted to transmit at least one of a gas and a liquid therethrough; and   wherein the head structure is adapted to permit the transmission of at least one of a gas and a liquid through the supply openings and at the same time the head structure is also adapted to permit the transmission of at least one of a gas and a liquid through the return openings.   
     
     
         2 . The apparatus of  claim 1 , wherein supply openings and the return openings have a width in the range of 100 to 1000 microns. 
     
     
         3 . The apparatus of  claim 1 , wherein the supply openings and the return openings have a width in the range of 200 to 800 microns. 
     
     
         4 . The apparatus of  claim 1 , wherein the supply openings and the return openings are generally rectangular in shape. 
     
     
         5 . The apparatus of  claim 1 , wherein the supply opening and the return openings are arranged to define a shape selected from the group consisting of a square array of openings and a rectangular array of openings on the first surface. 
     
     
         6 . The apparatus of  claim 1 , further comprising a gasket positioned to contact the first surface and to contact the surface to be cleaned, the gasket positioned to surround at least a portion of the surface to be cleaned and inhibit the flow of gas and liquid. 
     
     
         7 . The apparatus of  claim 6 , the gasket includes an angled surface region relative to the surface to be cleaned, the angled surface region adapted to contact an outer edge of the surface to be cleaned. 
     
     
         8 . The apparatus of  claim 6 , further comprising a manifold adapted to transmit gas and liquid through the head towards the surface to be cleaned and away from the surface to be cleaned. 
     
     
         9 . The apparatus of  claim 1 , wherein the supply openings on the first surface are in communication with a supply path through the head, and wherein the return openings on the first surface are in communication with a return path through the head, wherein the supply path and the return path are independent of one another. 
     
     
         10 . A method for cleaning a material from a surface of an electronic device, comprising:
 providing a head structure including a first surface facing a surface to be cleaned on the electronic device, the first surface including a plurality of supply openings and a plurality of return openings, at least a portion of the supply openings and return openings positioned as alternating rows of supply openings and return openings on the first surface, the supply openings being larger in area than the return openings in a majority of the alternating rows of supply openings and return openings;   transmitting a gas through the supply openings so that the gas contacts the surface to be cleaned;   removing the gas from the surface to be cleaned through the return openings;   transmitting a liquid through the supply openings so that the liquid contacts the surface to be cleaned; and   removing the liquid from the surface to be cleaned through the return openings;   wherein a quantity of foreign material on the surface to be cleaned is removed from the surface to be cleaned through the return openings during the removing the gas and the removing the liquid through the supply openings.   
     
     
         11 . The method of  claim 10 , further comprising performing the transmitting a liquid and the removing the liquid during the transmitting a gas and the removing the gas. 
     
     
         12 . The method of  claim 11 , further comprising performing the transmitting a liquid and the removing the liquid for less time than the transmitting a gas and the removing the gas. 
     
     
         13 . The method of  claim 10 , further comprising positioning the first surface and the surface to be cleaned to be no further than  1  mm from each other. 
     
     
         14 . The method of  claim 10 , further comprising utilizing air as the gas and utilizing water as the liquid. 
     
     
         15 . The method of  claim 11 , further comprising performing the transmitting a gas for a time including:
 a first time period during which there is no transmitting of the liquid;   a second time period during which there is transmitting of the liquid; and   a third time period during which there is no transmitting of the liquid.   
     
     
         16 . The method of  claim 15 , wherein the third time period is greater than the first and second time periods. 
     
     
         17 . An apparatus to clean an electronic device comprising:
 a head structure including a first surface adapted to face a body to be cleaned;   a plurality of supply openings and a plurality of return openings on the first surface, the supply openings and the return openings arranged as rows on the first surface;   wherein at least a majority of the rows are arranged to includes a two rows of supply openings adjacent to each other and then a row of return openings, followed again by two rows of supply openings adjacent to each other and then a row of return openings adjacent to one of the rows of supply openings, wherein a distance between the two rows of supply openings adjacent to each other is less than the distance between the row of return openings adjacent to the row of supply openings;   wherein the supply openings are adapted to transmit at least one of a gas and a liquid therethrough;   wherein the return openings are adapted to transmit at least one of a gas and a liquid therethrough;   wherein the head structure is configured to permit transmission of at least one of a gas and a fluid through the supply openings and the transmission of at least one of a gas and a liquid through the return openings at the same time.   
     
     
         18 . The apparatus of  claim 17 , wherein supply openings and the return openings have a width in the range of 100 to 1000 microns. 
     
     
         19 . The apparatus of  claim 17 , wherein the supply openings and the return openings are generally circular in shape. 
     
     
         20 . The apparatus of  claim 17 , wherein the supply openings and the return openings have the same width on the first surface.