Method for Predetermined Component Placement to a Target Platform

Abstract

Method for aligning electrical contacts of first and second electronic circuits or assemblies, the first and second electronic circuits or assemblies each being provided with alignment features. The method includes placing electrical contacts of the second electronic circuit or assembly in contact or near contact with electrical contacts of the first electronic circuit or assembly. An alignment condition of alignment features of the first and second electronic circuits or assemblies are electrically sensed during the contact or near contact to obtain sensing information. The sensing information is stored and analyzed to determine a movement to be caused between the first and second electronic circuits or assemblies to achieve an improved alignment condition. Each of the alignment features comprises a plurality of alignment elements. The electrically sensing step electrically senses an alignment condition of alignment elements of alignment features of the first and second electronic circuits or assemblies.

1 . A method for aligning electrical contacts of a second electronic circuit or assembly with electrical contacts of a first electronic circuit or assembly, the first electronic circuit or assembly and the second electronic circuit or assembly each being provided with alignment features, the method comprising:
 placing electrical contacts of the second electronic circuit or assembly in contact or near contact with electrical contacts of the first electronic circuit or assembly;   electrically sensing an alignment condition of alignment features of the second electronic circuit or assembly and alignment features of the first electronic circuit or assembly during the contact or near contact to obtain a sensing information;   storing the sensing information; and   analyzing the sensing information to determine a movement to be caused between the second electronic circuit or assembly and the first electronic circuit or assembly to achieve an improved alignment condition, wherein each of the alignment features comprises a plurality of alignment elements, and wherein the electrically sensing step electrically senses an alignment condition of alignment elements of an alignment feature of the second electronic circuit or assembly and alignment elements of an alignment feature of the first electronic circuit or assembly.   
     
     
         2 . The method of  claim 1  including moving the second electronic circuit or assembly to achieve an improved alignment condition following the electrically sensing. 
     
     
         3 . The method of  claim 1 , wherein the electrically sensing includes:
 providing a probe arrangement having a plurality of sensor elements to electrically sense an alignment condition; and   dynamically configuring the probe arrangement to select a subset of the sensor elements for sensing the alignment condition.   
     
     
         4 . The method of  claim 1  including:
 providing a probe arrangement to electrically sense an alignment condition; 
 holding the first electronic circuit or assembly stationary; and 
 aligning the probe arrangement in relation to the first electronic circuit or assembly. 
 
     
     
         5 . The method of  claim 1  wherein the electrically sensing includes applying an electrical stimulus to the alignment feature to electrically sense presence or absence of the electrical stimulus. 
     
     
         6 . The method of  claim 5  wherein the sensing is resistive. 
     
     
         7 . The method of  claim 5  wherein the sensing is capacitive. 
     
     
         8 . The method of  claim 5  including applying an electrical stimulus in parallel to a plurality of alignment features. 
     
     
         9 . The method of  claim 5  including applying an electrical stimulus in series to a plurality of alignment features. 
     
     
         10 . The method of  claim 1  including pre-storing dimensional information pertaining to an alignment feature prior to electrically sensing.