Method for Predetermined Component Placement to a Target Platform

Abstract

A method for aligning an assembled multi-component electronic apparatus including providing a first component with first and second surfaces, an alignment mark at the second surface, and interface contacts on the second surface. The alignment mark has sensors and a spatial relationship to the interface contacts. The method further includes providing a second component including a first surface, a reference mark at the first surface, and interface contacts on the first surface. The reference mark has a spatial relationship to the interface contacts of the second component. The method further includes creating a conduction path through the sensors and reference mark when each of the sensors is terminated by an external probe when the reference mark is in a first position with respect to the sensors. Then the interface contacts of the first and second components are aligned.

1 . A method for aligning an assembled multi-component electronic apparatus, the method comprising:
 providing a first component including:
 a first surface, 
 a second surface, 
 at least one alignment mark at the second surface of the first component, the at least one alignment mark having a plurality of sensors, and 
 a plurality of interface contacts on the second surface of the first component, the at least one alignment mark having a spatial relationship to the plurality of interface contacts of the first component; and 
   providing a second component including:
 a first surface, 
 at least one reference mark at the first surface of the second component, and 
 a plurality of interface contacts on the first surface of the second component, the at least one reference mark having a spatial relationship to the plurality of interface contacts of the second component, 
   creating a conduction path through each of the plurality of sensors and the at least one reference mark when each of the plurality of sensors is terminated by an external probe when the at least one reference mark is in a first position with respect to the plurality of sensors, thereby aligning the plurality of interface contacts of the first component with the plurality of interface contacts of the second component when the at least one reference mark is in the first position with respect to the plurality of sensors.   
     
     
         2 . The method of  claim 1  wherein the at least one reference mark is larger than each of the plurality of sensors. 
     
     
         3 . The method of  claim 1  including overlapping the reference mark with each of the plurality of sensors when the at least one reference mark is in the first position with respect to the plurality of sensors. 
     
     
         4 . The method of  claim 1  including coupling the conduction path to power or ground. 
     
     
         5 . The method of  claim 1  including terminating the conduction path at the first surface of the first component. 
     
     
         6 . The method of  claim 1  including terminating the conduction path at the first surface of the second component 
     
     
         7 . The method of  claim 1  including terminating the conduction path at the first surface of the first component and at the first surface of the second component. 
     
     
         8 . The method of  claim 1 , wherein the second component includes a second surface. 
     
     
         9 . The method of  claim 8  including terminating the conduction path at the first surface of the first component and at the second surface of the second component. 
     
     
         10 . The method of  claim 8  including terminating the conduction path at the first surface of the second component and at the second surface of the second component. 
     
     
         11 . The method of  claim 8  including terminating the conduction path at the second surface of the second component. 
     
     
         12 . The method of  claim 1  including coupling a current in the conduction path between the at least one reference mark and one of the plurality of sensors. 
     
     
         13 . The method of  claim 12  including contacting one of the plurality of sensors with the at least one reference mark, wherein the current is a direct current. 
     
     
         14 . The method of  claim 12  including capacitively coupling one of the plurality of sensors to the at least one reference mark, wherein the current is an alternating current. 
     
     
         15 . The method of  claim 1  including coupling an optical signal in the conduction path between the at least one reference mark and one of the plurality of sensors. 
     
     
         16 . The method of  claim 1 , wherein the first component is a printed circuit board, a system mother board, a flex circuit, an optical device, an electronic substrate, a ceramic board, an integrated circuit bare die, a stacked integrated circuit die, a stacked integrated circuit chip, an integrated circuit encapsulated in a package, or an electronic device laminated with anisotropic conducting elastomer at a surface of one of the plurality of sensors. 
     
     
         17 . The method of  claim 1 , wherein the second component is a printed circuit board, a system mother board, a flex circuit, an optical device, an electronic substrate, a ceramic board, an integrated circuit bare die, a stacked integrated circuit die, a stacked integrated circuit chip, an integrated circuit encapsulated in a package, or an electronic device laminated with anisotropic conducting elastomer at a surface of one of the plurality of sensors. 
     
     
         18 . The method of  claim 7  including locating a portion of the conduction path within the first component, on the first surface of the first component, or on the second surface of the first component. 
     
     
         19 . The method of  claim 7  including locating a portion of the conduction path within the second component, on the first surface of the second component, or on the second surface of the second component.