Monolithic Fin-type Heat Sink

Abstract

A fin-type heat sink applied to a electronic device includes a flake structured contact section adhered to an electronic component via an adhesive material, and a fin section including a plurality of pleats extending horizontally from the contact section, so as to substantially increase a heat-sinking area of the heat sink and effectively reduce heat generated when the electronic component is under operation. The contact section and the fin section are monolithically formed from a heat conductive metal, and since the fin section can be deformed with respect to the contact section to make room for any ambient components around the electronic component such that the fin-type heat sink is applicable to various situations without customization.

1 . A monolithic fin-type heat sink, comprising:
 a contact section, configured to adhere to an electronic component to conduct heat generated by the electronic component, comprising:
 a flake structure extending in a horizontal direction; and 
 a contact area, wherein the contact area is no smaller than an area of a grain of the electronic component; and 
   a fin section, extending from both sides of the contact section in an axis parallel to the horizontal direction, wherein a part of the fin section is capable of being deformed in a way that the part of the fin section generates a shift away from the axis.   
     
     
         2 . The fin-type heat sink of  claim 1 , further comprising an adhesive material disposed between the contact section and the electronic component to adhere the contact section to the electronic component, wherein the contact area is an area which the adhesive material applies to adhere the electronic component to the contact section. 
     
     
         3 . The fin-type heat sink of  claim 2 , wherein the adhesive material is double-sided adhesive tape or thermosetting adhesive. 
     
     
         4 . The fin-type heat sink of  claim 1 , wherein the contact area is no smaller than an area of the electronic component. 
     
     
         5 . The fin-type heat sink of  claim 1 , wherein the fin section is formed by folding the flake structure. 
     
     
         6 . The fin-type heat sink of  claim 5 , wherein the fin-type heat sink is monolithically formed by a copper or aluminum sheet. 
     
     
         7 . The fin-type heat sink of  claim 1 , further comprising an insulator sheet, configured on one side of the fin section, which is the same side as the electronic component. 
     
     
         8 . The fin-type heat sink of  claim 1 , wherein the fin section comprises a plurality of pleats, and the contact section and the plurality of pleats have a substantial identical thickness. 
     
     
         9 . The fin-type heat sink of  claim 1 , wherein the fin section does not contact the electronic component and the fin section is capable of being deformed according to a component placement around the electronic component. 
     
     
         10 . The fin-type heat sink as claimed in  claim 1 , wherein the fin section is folded into a three-sided shape, which has a vertical part orthogonal to the horizontal direction and another part parallel to the horizontal direction.