Apparatus for chemical mechanical polishing

Abstract

Embodiments of the invention generally relate to systems and methods to CMP substrates. The systems generally include a polishing system that has a polishing module and cleaning module. Each of the polishing module and the cleaning module can be partitioned into independently operable sections. Each section of the polishing module includes a platen, at least one load cup, and at least one polishing head. Each section of the cleaning module includes a cleaning station and one or more robots adapted to advance substrates through the cleaning station. The methods generally include polishing a plurality of substrates in a polishing system having independently operable sections. During the polishing of the substrates in one section, a second of the independently operable stations may be maintained or cleaned.

1 . An apparatus, comprising:
 a polishing module having a first polishing station and a second polishing station;   a partition including a housing and an actuatable door located within the polishing module between the first polishing station and the second polishing station, the actuatable door adapted to be positioned to environmentally isolate the first polishing station from the second polishing station; and   an overhead track disposed above the first polishing station and the second polishing station.   
     
     
         2 . The apparatus of  claim 1 , wherein the at least two polishing stations are independently operable when separated by the partition. 
     
     
         3 . The apparatus of  claim 1 , wherein the overhead track includes a movable seal coupled thereto, the movable seal adapted to be engaged by the actuatable door. 
     
     
         4 . The apparatus of  claim 1 , wherein the actuatable door is adapted to be positioned within the housing and extend therefrom. 
     
     
         5 . The apparatus of  claim 4 , wherein the actuatable door is positioned on a track. 
     
     
         6 . The apparatus of  claim 5 , wherein the actuatable door, when extended from the housing, forms a substantially air-tight seal separating the first polishing station from the second polishing station. 
     
     
         7 . The apparatus of  claim 1 , further comprising a cleaning module coupled to the polishing module, the cleaning module having a first cleaning station, and second cleaning station, and a central transfer area disposed therebetween. 
     
     
         8 . The apparatus of  claim 7 , further comprising a trough having at least two shuttles therein, the trough in operable communication with the first cleaning station, the second cleaning station, and the central transfer area. 
     
     
         9 . The apparatus of  claim 8 , wherein the trough further comprises a plurality of partitions actuatable to selectively partition portions of the trough. 
     
     
         10 . The apparatus of  claim 9 , wherein actuation of at least one the plurality of trough partitions isolates the first cleaning station from the central transfer region and the second cleaning station. 
     
     
         11 . An apparatus, comprising:
 a polishing module, the polishing module comprising:
 a first polishing station; 
 a second polishing station 
 a partition including a housing and an actuatable door located within the polishing module between the first polishing station and the second polishing station, the actuatable door adapted to be positioned to environmentally isolate the first polishing station from the second polishing station; and 
 a curved overhead track disposed above the first polishing station and the second polishing station; 
   a cleaning module adjacent to and in operable communication with the polishing module, the cleaning module comprising:
 a first cleaning station; 
 a second cleaning station; 
 a central transfer region positioned between the first cleaning station and the second cleaning station; and 
 a trough disposed at one end of the cleaning module, the trough in operable communication with the first cleaning station, the second cleaning station, and the central transfer region. 
   
     
     
         12 . The apparatus of  claim 11 , wherein the actuatable door is adapted to be positioned within and extend from the housing. 
     
     
         13 . The apparatus of  claim 14 , further comprising a movable seal coupled to the curved track, wherein the movable seal includes a slot adapted to be engaged by the actuatable door of the partition. 
     
     
         14 . The apparatus of  claim 12 , wherein the trough comprises a plurality of actuatable partitions therein. 
     
     
         15 . A method of processing substrates in a polishing system having a polishing module and a cleaning module, comprising:
 partitioning at least one of the cleaning module and the polishing module into a first section and a second section; and   performing at least one of cleaning or maintenance on the first section while processing a plurality of substrates in the second section.   
     
     
         16 . The method of  claim 15 , wherein partitioning at least one of the cleaning module and the polishing module comprises partitioning the polishing module, and wherein performing at least one of cleaning or maintenance comprises cleaning or maintaining the first section of the polishing module while processing a plurality of substrates in the second section of the polishing module and in the cleaning module. 
     
     
         17 . The method of  claim 16 , wherein partitioning the polishing module comprises actuating a door across the polishing module to separate a first polishing station from a second polishing station. 
     
     
         18 . The method of  claim 15 , wherein partitioning at least one of the cleaning module and the polishing module comprises partitioning the cleaning module, and wherein performing at least one of cleaning or maintenance comprises cleaning or maintaining the first section of the cleaning module while processing a plurality of substrates in the second section of the cleaning module and in the polishing module. 
     
     
         19 . The method of  claim 18 , wherein partitioning the cleaning module comprises actuating a partition located within a trough of the cleaning module. 
     
     
         20 . The method of  claim 15 , wherein partitioning at least one of the cleaning module and the polishing module comprises partitioning both the cleaning module and the polishing module.