Circuit board and radiating heat system for circuit board

Abstract

In the a circuit board, a plurality of conductive layer regions coated with a conductor are separately formed on both sides of an insulating substrate, the conductive layer region formed on either side of an insulating region on each of the both sides of the insulating substrate. The plurality of the conductive layer regions include a plurality of through holes which penetrate through the insulating substrate and are coated with a conductor over an inner wall, the conductor in the through hole electrically conducts the coated conductor of the plurality of the conductive layer regions, one of the lead pins is connected to one of the separated conductive layer regions on the both sides based on the insulating region, and the other lead pin is connected to the other conductive layer region.

1 - 5 . (canceled) 
     
     
         6 . A heat radiating system of a circuit board, comprising: the circuit board which comprises a plurality of conductive layer regions formed by coating both sides of an insulating substrate with a conductor, and a plurality of through holes formed by penetrating the insulating substrate in the conductive layer regions and coated with a conductor on an inner wall; a radiating pad which adheres to one side of the circuit board and receives heat from the circuit board, the radiating pad formed of an insulator; and a heat sink which is coupled to the radiating pad and receives and exhausts the heat of the circuit board from the radiating pad to outside, the heat sink formed of a metal. 
     
     
         7 . The heat radiating system of  claim 6 , wherein the radiating pad is formed of a silicon. 
     
     
         8 . The heat radiating system of  claim 6 , wherein the heat sink comprises a heat sink body which is formed in a plate shape and adheres to the radiating pad, and a fixing arm which is formed in a hook shape along a circumference of the heat sink body to secure the radiating pad with the circuit board. 
     
     
         9 . The heat radiating system of  claim 8 , wherein a radiating groove is depressed lengthwise in one direction of the heat sink body in one side of the heat sink body, the one side facing the radiating pad, and a plurality of the radiating grooves is formed at intervals in the other direction of the heat sink body. 
     
     
         10 . The heat radiating system of  claim 8 , wherein a radiating rib protrudes lengthwise in one direction of the heat sink body in the other side of the heat sink body, and a plurality of the radiating ribs is formed at intervals in the other direction of the heat sink body. 
     
     
         11 . The heat radiating system of  claim 8 , wherein the fixing arm bends toward the radiating pad from the circumference of the heat sink body and bends toward a center of the heat sink body.