Method and apparatus for manufacturing wound electrode assembly for battery
Abstract
The present invention aims to provide a method for bonding protective tapes to the cut edges of an electrode plate within a short period to prevent short circuit in an electrode assembly. An electrode plate cutting & tape bonding process includes (1) cutting an electrode plate into pieces 100 a and 100 b , (2) forming a gap W between edges 106 and 107 of the pieces 100 a and 100 b , (3) bonding protective tapes 51 and 52 to both sides of the pieces 100 a and 100 b , covering the edges and the gap, and (4) conveying the pieces 100 a and 100 b connected together. Next, the tapes 51 and 52 are cut into pieces 51 a & 52 a and 51 b & 52 b . Then, the electrode plate piece 100 a with the tape pieces 51 a & 52 a and 51 b & 52 b is wound together with a negative electrode plate, with a separator sandwiched therebetween.
Claims
exact text as granted — not AI-modified1 . A wound electrode assembly manufacturing apparatus for manufacturing a wound electrode assembly by pulling out a strip of electrode plate bit by bit, cutting off an electrode plate piece having a length of one cell from the electrode plate, and winding the electrode plate piece, the apparatus comprising:
an electrode plate cutter operable to cut off the electrode plate piece; a gap forming unit operable to form a gap between cut edges of the electrode plate piece and the electrode plate; a tape bonding unit operable to bond protective tapes to both sides of the electrode plate piece and the electrode plate to cover the gap and the cut edges; a tape cutter operable to cut the protective tapes at a position within the gap; and a winding unit operable to wind the electrode plate piece having the cut protective tapes bonded thereto.
2 . The apparatus of claim 1 , wherein
the electrode plate cutter, the gap forming unit and the tape bonding unit are provided in a first stage, and the tape cutter is provided in a second stage following the first stage.
3 . The apparatus of claim 1 , wherein
the gap forming unit forms the gap by pulling the electrode plate piece and the electrode plate away from each other.
4 . The apparatus of claim 3 , wherein
the electrode plate cutter, the gap forming unit and the tape bonding unit are provided in a first stage, and the tape cutter is provided in a second stage following the first stage.Join the waitlist — get patent alerts
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