Heat Sink

Abstract

The present disclosure pertains to a heat sink having a base, a heat exchanger being thermally coupled to a top surface of the base, a housing having a chamber formed therein and being placed over the base with the heat exchanger enclosed within the chamber, an inlet connected to the inlet chamber for directing heat transfer medium into the heat sink, and an outlet connected to the outlet chamber for discharging the heat transfer medium from the heat sink, wherein the heat exchanger has a plurality of plates and a plurality of spacers, thereby providing for a plurality of channels.

1 . A heat dissipation device comprising:
 a base;   a heat exchanger, the heat exchanger being thermally coupled to a top surface of the base;   a housing having a chamber formed therein, the housing being placed over the base with the heat exchanger enclosed within the chamber;   an inlet connected to the inlet chamber for directing heat transfer medium into the heat dissipation device;   and an outlet connected to the outlet chamber for discharging the heat transfer medium from the heat dissipation device;   wherein the heat exchanger has a plurality of plates and a plurality of spacers, thereby providing for a plurality of channels.   
     
     
         2 . The heat dissipation device of  claim 1  wherein the plates and spacers are alternatively superposed. 
     
     
         3 . The heat dissipation device of  claim 3  wherein the base and the plates are made of a thermally conductive material. 
     
     
         4 . The heat dissipation device of  claim 1  wherein the spacers are made of a thermally conductive material. 
     
     
         5 . The heat dissipation device of  claim 1  wherein the heat exchanger further comprises a core, the plates comprise a hole, and the spacers comprise a hole, wherein the holes of the plates and spacers receive the core. 
     
     
         6 . The heat dissipation device of  claim 5  wherein the core is made of a thermally conductive material. 
     
     
         7 . The heat dissipation device of  claim 1  wherein the plates are annular. 
     
     
         8 . The heat dissipation device of  claim 1 , wherein the chamber has an inlet chamber, outlet chamber, and heat exchanger chamber. 
     
     
         9 . The heat dissipation device of  claim 1 , wherein the inlet and outlet have a compression fitting. 
     
     
         10 . The heat dissipation device of  claim 1  further comprising a gasket and a slot, wherein the slot receives the gasket. 
     
     
         11 . The heat dissipation device of  claim 1  further comprising a mounting bracket. 
     
     
         12 . The heat dissipation device of  claim 1  further comprising a pump for circulating the flow of liquid to the heat transfer medium.