US2012301281A1PendingUtilityA1

Fan module

Assignee: WANG HSUAN-CHENGPriority: May 24, 2011Filed: Mar 13, 2012Published: Nov 29, 2012
Est. expiryMay 24, 2031(~4.8 yrs left)· nominal 20-yr term from priority
F04D 29/4226G06F 1/203F04D 29/601F04D 29/626F04D 25/0613F04D 17/16
39
PatentIndex Score
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Claims

Abstract

A fan module suitable for an electronic apparatus is provided. The fan module includes a bottom plate, a top cover. a sidewall, a heat-dissipating fan and a housing. The sidewall is assembled between the top cover and the bottom plate. The sidewall, the top cover and the bottom plate together form an accommodating space. The heat-dissipating fan is disposed on the bottom plate and located in the accommodating space. The housing is stacked on the top cover.

Claims

exact text as granted — not AI-modified
1 . A fan module, suitable for an electronic apparatus and comprising:
 a bottom plate;   a top cover;   a sidewall, assembled between the top cover and the bottom plate, wherein the sidewall, the top cover and the bottom plate together form an accommodating space;   a heat-dissipating fan, disposed on the bottom plate and located in the accommodating space; and   a housing, stacked on the top cover.   
     
     
         2 . The fan module as claimed in  claim 1 , wherein the housing and the sidewall are integrally formed. 
     
     
         3 . The fan module as claimed in  claim 1 , wherein the housing covers a first portion of the top cover and exposes a second portion of the top cover, a structure part of the electronic apparatus contacts the housing, the structure part and the second portion have a gap therebetween to form an inlet and the inlet is communicated with the accommodating space. 
     
     
         4 . The fan module as claimed in  claim 3 , wherein the top cover has an opening, the opening exposes the accommodating space and the inlet is communicated with the accommodating space through the opening. 
     
     
         5 . The fan module as claimed in  claim 1 , wherein the housing and the bottom plate have an interval therebetween to form an outlet and the outlet is communicated with the accommodating space. 
     
     
         6 . The fan module as claimed in  claim 5 , further comprising a supporting pillar, wherein the supporting pillar is located at the outlet and supported between the bottom plate and the housing. 
     
     
         7 . The fan module as claimed in  claim 6 , wherein the housing has an extension portion, the extension portion is connected to an edge of the housing and the supporting pillar is supported between the bottom plate and the extension portion. 
     
     
         8 . The fan module as claimed in  claim 6 , wherein the housing and the supporting pillar are integrally formed. 
     
     
         9 . The fan module as claimed in  claim 1 , wherein the materials of the top cover and the bottom plate are metal. 
     
     
         10 . The fan module as claimed in  claim 1 , wherein the material of the housing is plastic. 
     
     
         11 . The fan module as claimed in  claim 1 , wherein the top cover and the housing are integrally formed. 
     
     
         12 . A fan module, suitable for an electronic apparatus and comprising:
 a bottom plate;   a top cover, the thickness of a first portion of the top cover is greater than the thickness of a second portion of the top cover;   a sidewall, assembled between the top cover and the bottom plate, wherein the sidewall, the top cover and the bottom plate together form an accommodating space; and   a heat-dissipating fan, disposed on the bottom plate and located in the accommodating space.   
     
     
         13 . The fan module as claimed in  claim 12 , wherein the top cover and the sidewall are integrally formed. 
     
     
         14 . The fan module as claimed in  claim 12 , wherein a structure part of the electronic apparatus contacts the first portion, the structure part and the second portion have a gap therebetween to form an inlet and the inlet is communicated with the accommodating space. 
     
     
         15 . The fan module as claimed in  claim 14 , wherein the top cover has an opening, the opening exposes the accommodating space and the inlet is communicated with the accommodating space through the opening. 
     
     
         16 . The fan module as claimed in  claim 12 , wherein the top cover and the bottom plate have an interval therebetween to form an outlet and the outlet is communicated with the accommodating space. 
     
     
         17 . The fan module as claimed in  claim 16 , further comprising a supporting pillar, wherein the supporting pillar is located at the outlet and supported between the bottom plate and the top cover. 
     
     
         18 . The fan module as claimed in  claim 17 , wherein the top cover and the supporting pillar are integrally formed. 
     
     
         19 . The fan module as claimed in  claim 12 , wherein the materials of the top cover and the bottom plate are metal.

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