Device and system for measuring material thickness

Abstract

A piezoelectric sensing device is described for measuring material thickness of target such as pipes, tubes, and other conduits that carry fluids. The piezoelectric sensing device comprises a substrate such as a flexible circuit material, a piezoceramic element, and a solder layer disposed therebetween. These features are arranged in manner that provides a low-profile measurement device suitable for high-temperature applications such as those applications in which the temperature exceeds 120° C. Embodiments of the piezoelectric sensing device can be configured for use as stand-alone units separately located on the target or for use as a string of sensing elements coupled together by way of the flexible circuit material.

1 . A measurement system for measuring material thickness of a target, said measurement system comprising:
 a substrate comprising a flexible circuit material having an area with an electrode with a t-shaped geometry;   a solder layer disposed on the electrode;   a piezoelectric element disposed on the solder layer, the piezoelectric element comprising a ceramic body having a first electrode, a second electrode, and a wrap tab that is coupled to each of the first electrode and the second electrode; and   a connection for conducting inputs and outputs to and from the piezoelectric element, wherein the flexible circuit material, the solder layer, and the piezoelectric element are arranged as a layered structure that has a profile height that does not exceed 3 mm.   
     
     
         2 . A measurement system according to  claim 1  further comprising a couplant disposed on one or more of the flexible circuit material and the ceramic body, wherein the couplant adheres to a surface of the target. 
     
     
         3 . A measurement system according to  claim 1  further comprising a protective layer disposed on the flexible circuit material. 
     
     
         4 . A measurement system according to  claim 1  wherein the flexible circuit material comprises a first layer, a second layer, and a conductor disposed between the first layer and the second layer, and wherein the connection comprises a connector coupled to the conductor and disposed on a free end of the flexible circuit material. 
     
     
         5 . A measurement system according to  claim 1  wherein the connection comprises a cable secured to one or more cable connections incorporated into the flexible circuit material. 
     
     
         6 . A measurement system according to  claim 1  further comprising instrumentation coupled to the connection, wherein the instrumentation is configured to transmit inputs to the ceramic body, and wherein the inputs excite the ceramic body. 
     
     
         7 . An apparatus for monitoring material thickness of a target, said apparatus comprising:
 a transducer array secured to the target; and   instrumentation coupled to the transducer array, wherein the transducer array comprises a piezoelectric sensing device, wherein the piezoelectric sensing device comprises a layered structure that has a flexible circuit material, a solder layer, and a ceramic body coupled to the flexible circuit material via the solder layer, and wherein the layered structure has a profile height that does not exceed 3 mm.   
     
     
         8 . An apparatus according to  claim 7  further comprising a protective layer disposed proximate a frontside of the flexible circuit material. 
     
     
         9 . An apparatus according to  claim 7  further comprising a fastening mechanism operatively configured to apply a force to the piezoelectric sensing device. 
     
     
         10 . An apparatus according to  claim 7  further comprising an couplant disposed on one or more of the flexible circuit material and the ceramic body, wherein the couplant adheres to the target.