Circuit board and radiating heat system for circuit board

Abstract

In a circuit board, a plurality of conductive layer regions coated with a conductor are separately formed on both sides of an insulating substrate, the conductive layer region formed on either side of an insulating region on each of the both sides of the insulating substrate. The plurality of the conductive layer regions include a plurality of through holes which penetrate through the insulating substrate and are coated with a conductor over an inner wall, the conductor in the through hole electrically conducts the coated conductor of the plurality of the conductive layer regions, one of the lead pins is connected to one of the separated conductive layer regions on the both sides based on the insulating region, and the other lead pin is connected to the other conductive layer region.

1 - 4 . (canceled) 
     
     
         5 . A circuit board comprising: an upper insulating region which is formed on an upper side of an insulating region to insulate electricity; a first conductive layer region and a second conductive layer region which are separately formed on both sides of the upper insulating region and coated with a conductor; a lower insulating region which is formed on a lower side of the insulating substrate to insulate electricity; a third conductive layer region and a fourth conductive layer region which are formed separately on both sides of the lower insulating region and coated with a conductor, the third conductive layer region facing the first conductive layer region and the fourth conductive layer region facing the second conductive layer region; and a plurality of through holes which penetrate the insulating substrate and are coated with a conductor in inner wall to electrically conduct the first conductive layer region with the third conductive layer region and the second conductive layer region with the fourth conductive layer region. 
     
     
         6 - 11 . (canceled)