Sensor Arrangement With Snap-Off Segments

Abstract

A sensor arrangement has first and second substrates arranged in juxtaposed relation to each other. A working electrode is interposed between the first and second substrates. At least one of the first and second substrates has transaxial scoring for facilitating the snapping off of segments of the first and second substrates to expose a clean portion of the working electrode. A further electrode, which may be a silver deposition, is disposed on the first substrate. A still further electrode, which may be a gold deposition, is disposed on the second substrate. The working electrode is a wire disposed axially in relation to the first and second substrates. The wire is formed of gold, indium, glassy carbon, copper, silver, or the like, and any of these can be used alone or as an amalgam with mercury. The working electrode may be printed or deposited on at least one of the substrates.

1 . A sensor arrangement comprising:
 first and second substrates arranged in juxtaposed relation to each other; and   a working electrode interposed between said first and second substrates;   wherein at least one of the first and second substrates has transaxial scoring for facilitating the snapping off of segments of said first and second substrates to expose a clean portion of said working electrode.   
     
     
         2 . The sensor arrangement of  claim 1 , wherein there is provided a further electrode deposited on said first substrate. 
     
     
         3 . The sensor arrangement of  claim 2 , wherein said further electrode comprises a silver deposition. 
     
     
         4 . The sensor arrangement of  claim 2 , wherein there is provided a still further electrode deposited on said second substrate. 
     
     
         5 . The sensor arrangement of  claim 4 , wherein said further electrode comprises a gold deposition. 
     
     
         6 . The sensor arrangement of  claim 1 , wherein said working electrode comprises a wire disposed axially in relation to said first and second substrates. 
     
     
         7 . The sensor arrangement of  claim 6 , wherein said wire is comprised of a selectable combination of gold, iridium, glassy carbon, copper, silver, or the like, and any of these as an amalgam with mercury. 
     
     
         8 . The sensor arrangement of  claim 1 , wherein said working electrode comprises a deposition disposed axially in relation to said first and second substrates. 
     
     
         9 . The sensor arrangement of  claim 8 , wherein said deposition comprises a conductive layer deposited on at least one of said first and second substrates. 
     
     
         10 . The sensor arrangement of  claim 9 , wherein said conductive layer deposited on at least one of said first and second substrates is a gold layer. 
     
     
         11 . The sensor arrangement of  claim 1 , wherein there are provided a plurality of working electrodes interposed between said first and second substrates, wherein the snapping off of segments of said first and second substrates exposes a clean portion of each of said plurality of working electrodes. 
     
     
         12 . The sensor arrangement of  claim 11 , wherein said plurality of working electrodes are formed of a selectable combination of gold, iridium, glassy carbon, copper, silver, or the like, and any of these as an amalgam with mercury. 
     
     
         13 . The sensor arrangement of  claim 1 , wherein there is further provided a connector arrangement disposed on said first substrate, said connector arrangement being in electrical communication with said working electrode.