Heat transfer device and system

Abstract

Heat transfer device including: a first reservoir (R 1 ) for storing a diphasic fluid (LC), equipped with first heating means (MC 1 ) and connected to a cold source (SF) via a first thermal resistance (RTH 1 ); a second reservoir (R 2 ) for storing said diphasic fluid, equipped with second heating means (MC 2 ) and connected to said cold source or to another cold source via a second thermal resistance (RTH 2 ); and a fluidic pipe (CF) through which said diphasic fluid may pass, connecting said first and second reservoirs, said pipe including at least: an evaporator (EV) that may be thermally connected to a hot source (PC, O) at a temperature higher than that of said cold source; a first condenser (C 1 ) and a second (C 2 ) condenser situated on either side of said evaporator and adapted to be thermally connected to said cold source. Heat transfer system including at least one such device. Method for cooling or precooling an object by means of such a device or system.

1 . A heat transfer device including:
 a first reservoir for storing a diphasic fluid, equipped with first heating means and connected to a cold source via a first thermal resistance;   a second reservoir for storing said diphasic fluid, equipped with second heating means and connected to said cold source or to another cold source via a second thermal resistance; and   a fluidic pipe able to be traversed by said diphasic fluid, connecting said first and second reservoirs, said pipe including at least:   an evaporator able to be thermally connected to a hot source at a temperature higher than that of said cold source;   a first condenser and a second condenser situated on either side of said evaporator and able to be thermally connected to said cold source;   
       said first and second heating means and said fluidic pipe being arranged in such a manner that activation of the first heating means causes expulsion of said diphasic fluid from said first reservoir toward said second reservoir via said fluidic pipe and activation of the second heating means causes expulsion of said diphasic fluid from said second reservoir toward said first reservoir via said fluidic pipe. 
     
     
         2 . The heat transfer device claimed in  claim 1 , containing a diphasic fluid in an amount at least sufficient, in the liquid state, to fill said fluidic pipe and part of the volume of one of said first and second reservoirs, but insufficient, in the liquid state, to fill both reservoirs and said fluidic pipe. 
     
     
         3 . The heat transfer device claimed in  claim 1 , wherein said and second reservoirs have a capacity greater than that of the fluidic pipe. 
     
     
         4 . The heat transfer device claimed in  claim 1 , wherein said first and second reservoirs have the same capacity. 
     
     
         5 . The heat transfer device claimed in  claim 1 , wherein said diphasic fluid is a cryogenic fluid having a critical temperature less than or equal to 200K. 
     
     
         6 . The heat transfer device claimed in  claim 1  further including at least one cold source including cooling means adapted to bring it to a temperature enabling the existence of a liquid phase of said fluid inside said reservoirs. 
     
     
         7 . The heat transfer device claimed in  claim 1  wherein said fluid pipe is connected to said first and second reservoirs via respective bleeds produced at the lower ends thereof. 
     
     
         8 . The heat transfer device claimed in  claim 1  wherein each of said first and second reservoirs contains a thermally conductive porous material, wettable by the liquid phase of said diphasic fluid, in thermal contact with said heating means. 
     
     
         9 . The heat transfer device claimed in  claim 1  wherein said fluidic pipe is connected to a pressure reduction reservoir. 
     
     
         10 . The heat transfer device claimed in  claim 1  further including a control device adapted to activate alternately the first heating means and the second heating means in such a manner as to cause a transfer of said diphasic fluid from said first reservoir to said second reservoir and vice versa. 
     
     
         11 . The heat transfer system claimed in  claim 10  including two devices (Da, Db) thermally connected between said hot source and said cold source, or respective cold sources, wherein said control devices are configured to activate the respective heating means periodically and in phase quadrature. 
     
     
         12 . The heat transfer system claimed in  claim 1  including a device and a heat transfer passive diphasic device, such as a fluidic loop heat pipe or a pulsating heat pipe, thermally connected between said hot source and said cold source, or respective cold sources. 
     
     
         13 . The heat transfer system claimed in  claim 12  wherein said heat transfer passive diphasic device is connected to said first and second reservoirs via a system of valves enabling it to be filled with diphasic fluid. 
     
     
         14 . The heat transfer system claimed in  claim 1 , including a device wherein a pulsating heat pipe thermally connected between said hot source and cold source is integrated into said fluidic pipe. 
     
     
         15 . A method of cooling or precooling an object by means of the device claimed in  claim 1 , including the following steps:
 a. Thermally connecting said object to the evaporator of said device so that it functions as a hot source;   b. Thermally connecting said first and second reservoirs and said first and second condensers to said cold source or to respective cold sources in such a manner as to cause at least partial filling of at least said first reservoir with a liquid phase of said diphasic fluid;   c. Activating said first heating means so that said liquid phase of said diphasic fluid flows toward said second reservoir via said evaporator, in which it evaporates at least partially, cooling said object, and said second condenser, where the vapor formed in this way returns to the diphasic state;   d. Deactivating said first heating means when the first reservoir is substantially empty of said liquid phase;   e. Activating said second heating means so that said liquid phase of said diphasic fluid flows toward said first reservoir via said evaporator, where it is evaporated at least in part, cooling said object, and said first condenser, where the vapor formed in this way returns to the diphasic state; and   f. Deactivating said second heating means when the second reservoir is substantially empty of said liquid phase;   
       the steps c. to f. being repeated cyclically. 
     
     
         16 . The method claimed in  claim 15  of cooling an object, including a precooling step followed by a step of thermal stabilization by means of a heat transfer passive diphasic device.