Refrigeration apparatus

Abstract

A refrigeration apparatus includes: a refrigerant circuit to which a compressor is connected, and which performs a refrigerating cycle; an electronic part including a power module; and a cooling member in which a refrigerant of the refrigerant circuit flows, and which contacts the power module so that the power module is cooled by the refrigerant. The cooling member of the refrigeration apparatus is provided with a thermal insulation layer that prevents cold heat of the refrigerant flowing in the cooling member from being transferred to the outside from at least a non-contact surface other than a contact surface of the cooling member with the power module.

1 . A refrigeration apparatus, comprising:
 a refrigerant circuit to which a compressor is connected, and which performs a refrigerating cycle;   an electronic part including a power module; and   a cooling member in which a refrigerant of the refrigerant circuit flows, and which contacts the power module so that the power module is cooled by the refrigerant, wherein   the cooling member includes a preventing unit that prevents cold heat of the refrigerant flowing in the cooling member from being transferred to outside from at least a non-contact surface other than a contact surface of the cooling member with the power module.   
     
     
         2 . The refrigeration apparatus of  claim 1 , wherein
 the cooling member includes a main body in which a cooling refrigerant configured to cool the power module flows, and which contacts the power module, and   the preventing unit is formed by a thermal insulation layer that covers a non-contact surface other than a contact surface of the main body with the power module.   
     
     
         3 . The refrigeration apparatus of  claim 1 , wherein
 the preventing unit includes a high temperature refrigerant flow path in which a high temperature refrigerant flows, and the high temperature refrigerant flow path is formed on a side of the non-contact surface with respect to a cooling refrigerant flow path of the cooling member in which the cooling refrigerant flows.   
     
     
         4 . The refrigeration apparatus of  claim 3 , wherein
 the preventing unit has a thermal insulation layer formed between the cooling refrigerant flow path and the high temperature refrigerant flow path.   
     
     
         5 . The refrigeration apparatus of  claim 4 , wherein
 the thermal insulation layer is formed by a vacuum layer or an air layer.   
     
     
         6 . The refrigeration apparatus of any one of  claims 1  to  5 , wherein
 a decompression mechanism, which decompresses the refrigerant of the refrigerant circuit and generates the cooling refrigerant, is provided in the cooling member. 
 
     
     
         7 . The refrigeration apparatus of  claim 6 , wherein
 the cooling member is configured so that the cooling refrigerant, which has cooled the power module, exchanges heat with the refrigerant located upstream of the decompression mechanism in the cooling member.   
     
     
         8 . The refrigeration apparatus of  claim 6 , wherein
 a thermal insulation pipe is connected to a refrigerant outlet of the cooling member.   
     
     
         9 . The refrigeration apparatus of  claim 1 , wherein
 the preventing unit is configured to prevent the cold heat of the refrigerant flowing in the cooling member from being transferred to the outside from an outer edge of the contact surface of the cooling member with the power module.   
     
     
         10 . The refrigeration apparatus of  claim 9 , wherein
 the preventing unit is configured so that a heat transfer surface, which transfers the cold heat of the refrigerant flowing in the cooling member to the power module, has a smaller area than a surface of the power module, which corresponds to the cooling member.   
     
     
         11 . The refrigeration apparatus of  claim 1 , wherein
 a non-contact surface, which is a surface of the power module other than a contact surface with the cooling member, is covered by a thermal insulation layer.   
     
     
         12 . The refrigeration apparatus of  claim 2  or  4 , wherein
 the thermal insulation layer is comprised of an insert-molded insulating resin. 
 
     
     
         13 . The refrigeration apparatus of any one of  claims 2 ,  4 , and  11 , wherein
 the thermal insulation layer is formed by spraying urethane.