US2012261705A1PendingUtilityA1

Light emitting device package and method for manufacturing the same

Assignee: KIM GEUN HOPriority: Aug 8, 2006Filed: Jun 22, 2012Published: Oct 18, 2012
Est. expiryAug 8, 2026(~0 yrs left)· nominal 20-yr term from priority
H10W 90/756H10W 90/753H10W 90/736H10W 90/724H10W 72/884H10W 72/0198H10H 20/8506H10H 20/8514
49
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Claims

Abstract

A light emitting device package capable of emitting uniform white light and a method for manufacturing the same are disclosed. The light emitting device package includes a package body, an electrode formed on at least one surface of the package body, a light emitting device mounted on the package body, and a phosphor layer enclosing the light emitting device while having a uniform thickness around the light emitting device.

Claims

exact text as granted — not AI-modified
1 . A light emitting device package comprising:
 a package body comprising a recess portion;   a lead frame connected to the package body;   a light emitting device located on the package body, the light emitting device being electrically connected to the lead frame;   a barrier rib located around the light emitting device, the barrier rib being spaced apart from a side of the light emitting device, wherein the barrier rib is located on the lead frame; and   a phosphor layer located inside the barrier rib.   
     
     
         2 . The light emitting device package according to  claim 1 , wherein the barrier rib is disposed in the recess portion. 
     
     
         3 . The light emitting device package according to  claim 1 , wherein the phosphor layer comprises a filler containing phosphor material. 
     
     
         4 . The light emitting device package according to  claim 1 , wherein a thickness of the phosphor layer disposed on the upper surface of the light emitting device is substantially equal to a thickness of the phosphor layer disposed on the side of the light emitting device. 
     
     
         5 . The light emitting device package according to  claim 1 , the light emitting device is disposed on the lead frame. 
     
     
         6 . The light emitting device package according to  claim 1 , wherein the barrier rib comprises walls substantially perpendicular to an upper surface of the light emitting device. 
     
     
         7 . The light emitting device package according to  claim 1 , wherein the barrier rib comprises one of a transparent photoresist, a photosensitive polymer, and glass. 
     
     
         8 . The light emitting device package according to  claim 1 , wherein the barrier rib has a height difference between the upper surface of the light emitting device and the top of barrier rib, wherein the height difference is substantially equal to a distance between the side of the light emitting device and the barrier rib. 
     
     
         9 . The light emitting device package according to  claim 1 , wherein the recess portion has a side surface, a height of the side surface of the recess portion is substantially equal to a height of the barrier rib. 
     
     
         10 . The light emitting device package according to  claim 9 , wherein a lower part of the side surface of the recess portion contacts with a lower part of the barrier rib. 
     
     
         11 . The light emitting device package according to  claim 9 , wherein an upper part of the side surface of the recess portion is spaced apart from an upper part of the barrier rib. 
     
     
         12 . The light emitting device package according to  claim 1 , wherein the lead frame comprises an upper lead frame on an upper surface of the package body and a lower lead frame on a lower surface of the package body. 
     
     
         13 . The light emitting device package according to  claim 12 , wherein the recess portion comprises a bottom surface and a side surface, the upper lead frame is extended from the bottom surface to the side surface of the recess portion. 
     
     
         14 . The light emitting device package according to  claim 1 , wherein a height of the phosphor layer is substantially the same as the depth of the recess portion. 
     
     
         15 . The light emitting device package according to  claim 1 , wherein the barrier rib forms a rectangular parallelepiped space. 
     
     
         16 . The light emitting device package according to  claim 1 , wherein the barrier rib comprises a transparent material. 
     
     
         17 . A light emitting device package comprising:
 a package body comprising a recess portion;   a lead frame connected to the package body, at least a portion of the lead frame being exposed via the recess portion;   a light emitting device disposed on the lead frame, the light emitting device being electrically connected to the lead frame;   a barrier rib located around the light emitting device, the barrier rib being a distance apart from a side of the light emitting device, wherein the barrier rib is located on the lead frame; and   a phosphor layer located inside of the barrier rib.   
     
     
         18 . The light emitting device package according to  claim 17 , wherein a height of the phosphor layer is substantially the same as the depth of the recess portion. 
     
     
         19 . The light emitting device package according to  claim 17 , wherein the recess portion has a side surface, a lower part of the side surface of the recess portion contacts with a lower part of the barrier rib. 
     
     
         20 . The light emitting device package according to  claim 17 , an upper part of the side surface of the recess portion is spaced apart from an upper part of the barrier rib.

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