US2012261705A1PendingUtilityA1
Light emitting device package and method for manufacturing the same
Est. expiryAug 8, 2026(~0 yrs left)· nominal 20-yr term from priority
H10W 90/756H10W 90/753H10W 90/736H10W 90/724H10W 72/884H10W 72/0198H10H 20/8506H10H 20/8514
49
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Claims
Abstract
A light emitting device package capable of emitting uniform white light and a method for manufacturing the same are disclosed. The light emitting device package includes a package body, an electrode formed on at least one surface of the package body, a light emitting device mounted on the package body, and a phosphor layer enclosing the light emitting device while having a uniform thickness around the light emitting device.
Claims
exact text as granted — not AI-modified1 . A light emitting device package comprising:
a package body comprising a recess portion; a lead frame connected to the package body; a light emitting device located on the package body, the light emitting device being electrically connected to the lead frame; a barrier rib located around the light emitting device, the barrier rib being spaced apart from a side of the light emitting device, wherein the barrier rib is located on the lead frame; and a phosphor layer located inside the barrier rib.
2 . The light emitting device package according to claim 1 , wherein the barrier rib is disposed in the recess portion.
3 . The light emitting device package according to claim 1 , wherein the phosphor layer comprises a filler containing phosphor material.
4 . The light emitting device package according to claim 1 , wherein a thickness of the phosphor layer disposed on the upper surface of the light emitting device is substantially equal to a thickness of the phosphor layer disposed on the side of the light emitting device.
5 . The light emitting device package according to claim 1 , the light emitting device is disposed on the lead frame.
6 . The light emitting device package according to claim 1 , wherein the barrier rib comprises walls substantially perpendicular to an upper surface of the light emitting device.
7 . The light emitting device package according to claim 1 , wherein the barrier rib comprises one of a transparent photoresist, a photosensitive polymer, and glass.
8 . The light emitting device package according to claim 1 , wherein the barrier rib has a height difference between the upper surface of the light emitting device and the top of barrier rib, wherein the height difference is substantially equal to a distance between the side of the light emitting device and the barrier rib.
9 . The light emitting device package according to claim 1 , wherein the recess portion has a side surface, a height of the side surface of the recess portion is substantially equal to a height of the barrier rib.
10 . The light emitting device package according to claim 9 , wherein a lower part of the side surface of the recess portion contacts with a lower part of the barrier rib.
11 . The light emitting device package according to claim 9 , wherein an upper part of the side surface of the recess portion is spaced apart from an upper part of the barrier rib.
12 . The light emitting device package according to claim 1 , wherein the lead frame comprises an upper lead frame on an upper surface of the package body and a lower lead frame on a lower surface of the package body.
13 . The light emitting device package according to claim 12 , wherein the recess portion comprises a bottom surface and a side surface, the upper lead frame is extended from the bottom surface to the side surface of the recess portion.
14 . The light emitting device package according to claim 1 , wherein a height of the phosphor layer is substantially the same as the depth of the recess portion.
15 . The light emitting device package according to claim 1 , wherein the barrier rib forms a rectangular parallelepiped space.
16 . The light emitting device package according to claim 1 , wherein the barrier rib comprises a transparent material.
17 . A light emitting device package comprising:
a package body comprising a recess portion; a lead frame connected to the package body, at least a portion of the lead frame being exposed via the recess portion; a light emitting device disposed on the lead frame, the light emitting device being electrically connected to the lead frame; a barrier rib located around the light emitting device, the barrier rib being a distance apart from a side of the light emitting device, wherein the barrier rib is located on the lead frame; and a phosphor layer located inside of the barrier rib.
18 . The light emitting device package according to claim 17 , wherein a height of the phosphor layer is substantially the same as the depth of the recess portion.
19 . The light emitting device package according to claim 17 , wherein the recess portion has a side surface, a lower part of the side surface of the recess portion contacts with a lower part of the barrier rib.
20 . The light emitting device package according to claim 17 , an upper part of the side surface of the recess portion is spaced apart from an upper part of the barrier rib.Join the waitlist — get patent alerts
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