Fastening and electroconductive connecting of a chip module to a chip card

Abstract

For manufacturing a chip card, a chip module ( 6 ) is connected adhesively to a chip-card body ( 2 ) electroconductively by a thermoplastic, electroconductive elastomeric material ( 5 ), and connected to at least one electrical contact area ( 2 b ) of the chip-card body ( 2 ) electroconductively by the elastomeric material ( 5 ).

1 .- 16 . (canceled) 
     
     
         17 . A method for manufacturing a chip card by electroconductive connecting of a chip module to a chip-card body having at least one electrical contact area, comprising the step:
 adhesively connecting the chip module to the chip-card body by a thermoplastic, electroconductive elastomeric material, so that the chip module is conductively connected to at least one electrical contact area of the chip-card body.   
     
     
         18 . The method according to  claim 17  wherein the chip card body includes an antenna, including connecting the chip module electroconductively to at least one electrical contact area of the antenna in the chip-card body. 
     
     
         19 . The method according to  claim 17 , wherein the steps of adhesive connecting of the chip module to the chip-card body comprises the steps:
 adhesively applying heated and melted elastomeric material at least to the at least one electrical contact area of the chip-card body and at least partially solidifying the elastomeric material,   applying the chip module to the at least partly solidified elastomeric material on the chip-card body,   again heating and melting the elastomeric material through at least one of the chip-card body and the chip module, so that a further adhesive connection is formed between the elastomeric material and the contact areas of the chip module, so that an electroconductive connection is established between the contact areas of the chip module and the contact areas of the chip-card body.   
     
     
         20 . The method according to  claim 17 , wherein the steps of the adhesive connecting of the chip module to the chip-card body comprises the steps:
 adhesively applying the heated and melted elastomeric material to the chip module and at least partially solidifying the elastomeric material,   applying the chip-card body to the at least partly solidified elastomeric material on the chip module,   again heating and melting the elastomeric material through at least one of the chip-card body and the chip module, so that a further adhesive connection is formed between the elastomeric material and the contact areas of the chip-card body, so that an electroconductive connection is established between the contact areas of the chip module and the contact areas of the chip-card body.   
     
     
         21 . The method according to  claim 19 , wherein the elastomeric material is adhesively applied with a conventional metering unit for hot-melt adhesives or an injection molding machine. 
     
     
         22 . The method according to  claim 19 , wherein the elastomeric material is adhesively applied in the form of a foil. 
     
     
         23 . The method according to  claim 19 , including adhesively applying an elastomeric material with conductive filler. 
     
     
         24 . The method according to  claim 23 , wherein, as an elastomeric material, there is adhesively applied a thermoplastic silicone. 
     
     
         25 . The method according to  claim 19 , including adhesively applying an elastomeric material that, upon adhesive connecting of the chip module to the chip-card body, enters into an adhesive connection with at least one of the chip module and the chip-card body at temperatures that lie below a maximum temperature load on either or both the chip module and the chip-card body. 
     
     
         26 . The method according to  claim 19 , including adhesively applying an elastomeric material wherein the strength of the adhesive connection between the chip module and the chip-card body is optimized. 
     
     
         27 . The method according to  claim 26 , wherein there is adhesively applied an elastomeric material to which an additive is admixed and/or on whose surface an adhesion promoter is applied. 
     
     
         28 . A chip card comprising a chip module, wherein the chip module is connected to a chip-card body of the chip card adhesively by a thermoplastic, electroconductive elastomeric material, so that the chip module is electroconductively connected to at least one electrical contact area of the chip-card body. 
     
     
         29 . The chip card according to  claim 28 , wherein the chip card comprises a contactless communication interface, whereby the chip card is configurable as a dual interface chip card. 
     
     
         30 . The chip card according to  claim 28 , wherein the chip card comprises an antenna incorporated into the chip-card body, said antenna being connected to the chip module electroconductively with the at least one electrical contact area. 
     
     
         31 . The chip card according to  claim 28 , wherein the elastomeric material is a thermoplastic silicone with conductive filler. 
     
     
         32 . The chip card according to  claim 28 , wherein the chip module has been adhesively connected to the chip-card body by the method recited in  claim 17 .