Coating on pdc/tsp cutter for accelerated leaching

Abstract

A cutting element that includes a polycrystalline diamond layer having a cutting face and a diamond layer side surface, a substrate attached to the polycrystalline diamond layer, the substrate having a bottom surface and a substrate side surface, an interface between the diamond layer and the substrate, and a mask covering at least the bottom surface and the substrate side surface of the cutting element is disclosed.

1 . A cutting element, comprising:
 a polycrystalline diamond layer, comprising:
 a cutting face; and 
 a diamond layer side surface; 
   a substrate attached to the polycrystalline diamond layer, the substrate comprising:
 a bottom surface; and 
 a substrate side surface; and 
   an interface between the diamond layer and the substrate; and   a mask covering at least the bottom surface and the substrate side surface of the cutting element.   
     
     
         2 . The cutting element of  claim 1 , wherein the mask is removable. 
     
     
         3 . The cutting element of  claim 1 , wherein the mask comprises diamond-like carbon. 
     
     
         4 . The cutting element of  claim 1 , wherein the mask comprises a chemical resistant air dry ink. 
     
     
         5 . The cutting element of  claim 1 , wherein the mask comprises a chemical resistant UV cured ink. 
     
     
         6 . The cutting element of  claim 1 , wherein the mask comprises Teflon. 
     
     
         7 . The cutting element of  claim 1 , wherein the mask is sealed to the cutting element. 
     
     
         8 . The cutting element of  claim 1 , wherein the mask comprises a top end, wherein the top end is substantially parallel with the cutting face. 
     
     
         9 . The cutting element of  claim 1 , wherein the mask comprises a top end, wherein the top end is non-planar. 
     
     
         10 . A method for leaching a cutting element, comprising:
 providing a cutting element, the cutting element comprising a substrate and polycrystalline diamond layer attached to the substrate;   masking at least the substrate portion of the cutting element with a mask, leaving an unmasked portion of the diamond layer of the cutting element;   placing the masked cutting element in a leaching agent, wherein at least the unmasked portion of the cutting element contacts the leaching agent; and   removing the masked cutting element from the leaching agent.   
     
     
         11 . The method of  claim 10 , further comprising removing the mask. 
     
     
         12 . The method of  claim 10 , wherein the step of placing the masked cutting element in the leaching agent further comprises holding the masked cutting element in place. 
     
     
         13 . The method of  claim 12 , wherein the masked cutting element is held in place by a magnetic capturing device. 
     
     
         14 . The method of  claim 10 , wherein the mask comprises diamond-like carbon. 
     
     
         15 . The method of  claim 10 , wherein the mask comprises a material selected from a chemical resistant air dry ink and a chemical resistant UV cured ink. 
     
     
         16 . The method of  claim 10 , wherein the mask comprises an institute mask. 
     
     
         17 . The method of  claim 10 , wherein the step of masking comprises encasing the cutting element with a mask material using injection molding. 
     
     
         18 . A method of leaching a cutting element, comprising:
 providing a cutting element, comprising a substrate and polycrystalline diamond layer attached to the substrate;   fitting at least the substrate portion of the cutting element in a pre-formed mask, leaving an unmasked portion of the diamond layer of the cutting element;   placing the cutting element in a leaching agent, wherein at least the unmasked portion of the cutting element contacts the leaching agent; and   removing the cutting element from the leaching agent.   
     
     
         19 . The method of  claim 18 , wherein the step of fitting further comprises:
 placing the pre-formed mask and the cutting element in a vacuum and applying heat to the pre-formed mask to tighten the pre-formed mask around the cutting element.   
     
     
         20 . The method of  claim 18 , further comprising sealing the pre-formed mask to the cutting element. 
     
     
         21 . The method of  claim 18 , further comprising removing the pre-formed mask. 
     
     
         22 . The method of  claim 18 , wherein the pre-formed mask comprises polyvinylchloride. 
     
     
         23 . The method of  claim 18 , wherein the step of placing the cutting element in the leaching agent further comprises holding the cutting element in place. 
     
     
         24 . The method of  claim 23 , wherein the masked cutting element is held in place by a magnetic capturing device.