Vacuum device by using centrifugal resources

Abstract

A wafer holding vacuum for a wafer polishing system and the wafer suction device for CMP (Chemical Mechanical Polishing) by utilizing existing resources provided by the rotating polishing post is provided. The device introduces a channel configured in the wafer suction device. One end of the channel is exposed at downside of the holding block, and another end of the tube is exposed at lateral side of the holding block. By aforementioned configuration, the channel can suck gas and/or liquid between the wafer and the device, and can discharge them to the outer environment at the lateral side using centrifugal force naturally provided by the polishing post.

1 . A wafer suction device, comprising:
 a block; and   at least one channel configured in said block, and one end of said at least one channel is exposed at a contact surface between said block and a wafer, whereby utilizing centrifugal force to suck fluid between said block and said wafer, and another end of said at least one channel is exposed at lateral side of said block, whereby discharging said fluid.   
     
     
         2 . The wafer suction device according to  claim 1 , further comprising at least one check valve configured at said another end of said at least one channel. 
     
     
         3 . The wafer suction device according to  claim 1 , wherein a fluid-guiding device is configured at an exit of said channel, whereby making said fluid outflows along a specific direction. 
     
     
         4 . The wafer suction device according to  claim 1 , wherein said at least one channel having a main channel and at least one sub-channel connected to said main channel, and one end of said main channel is exposed at said lateral side of said block, one end of said at least one sub-channel is exposed to said contact area between said block and said wafer, and another end of said at least one sub-channel is connected to said main channel for discharging said fluid. 
     
     
         5 . The wafer suction device according to  claim 4 , wherein connected zones between said main channel and said at least one sub-channel are formed as a Ventura tube. 
     
     
         6 . The wafer suction device according to  claim 4 , wherein said at least one sub-channel is non-vertically connected to said main channel. 
     
     
         7 . The wafer suction device according to  claim 4 , further comprising at least one check valve configured at one end of said main channel. 
     
     
         8 . The wafer suction device according to  claim 4 , wherein a fluid-guiding device is configured at an exit of said main channel, whereby making said fluid discharged along a specific direction. 
     
     
         9 . The wafer suction device according to  claim 1 , further comprising a fixing ring configured at down side of said block for fixing said wafer. 
     
     
         10 . A wafer polishing system, comprising:
 a polishing post body; and   a wafer suction device configured at bottom of said polishing post body for attaching a wafer;   wherein said wafer suction device containing:
 a block; and 
 at least one channel configured in said block, and one end of said at least one channel is exposed at a contact surface between said block and said wafer, whereby utilizing centrifugal force to suck fluid between said block and said wafer, and another end of said at least one channel is exposed at lateral side of said block, whereby discharging said fluid. 
   
     
     
         11 . The wafer polishing system according to  claim 10 , further comprising a check valve configured at another end of said at least one channel. 
     
     
         12 . A wafer polishing system, comprising:
 a polishing post body; and   a wafer suction device configured at bottom of said polishing post body for attaching a wafer;   wherein said wafer suction device containing:
 a block; 
 at least one main channel configured in said block, and one end of said at least one main channel is exposed at lateral side of said block; 
 at least one first sub-channel, wherein one end is exposed at contact surface between said block and said wafer, and another end is connected to another end of said at least one main channel; and 
 at least one second sub-channel, wherein one end is exposed at said contact surface between said block and said wafer, and another end is connected to body of said at least one main channel; 
 wherein connected zones between said at least one main channel and said at least one second sub-channel are formed as a Ventura tube. 
   
     
     
         13 . The wafer polishing system according to  claim 12 , further comprising at least one check valve configured at said end of said at least one main channel.