Device and method for electrically contacting treatment material in electroplating systems

Abstract

The subject matter is directed to electrical contacting of band- or plate-shaped materials ( 1 ), which are conveyed by transport track through an electroplating system. The cathodically polarized contact means ( 6 ) may be located on the underside of the material ( 1 ) in the electrolyte ( 12 ) circulated in the electroplating system. The material is electrically contacted to transfer current to the material ( 1 ). Each tubular contact means ( 6 ) is cooled by means of a cooling unit or a cooling medium. No metal is deposited on the cooled surface of the contact means ( 6 ) if the temperature difference between the working temperature of the electrolyte ( 12 ) and the surface temperature of the contact means ( 6 ) is sufficiently large. This property can be supplemented with a surface of the contact means ( 6 ) that cannot be cathodically metal-coated in the electrolyte ( 12 ) used.

1 . Device for electrical contacting material to be electroplated ( 1 ) by means of contact ( 2 , 6 ) in electroplating systems of all kinds, whereby the cathodically polarized means of contact ( 2 ,  6 ) extend at least partially into the electrolyte ( 12 ) and electrically contact the material to be electroplated, characterized in that at least one of the means of contact ( 2 ,  6 ) can be cooled by means of a cooling device and/or a cooling medium. 
     
     
         2 . Device according to  claim 1 , characterized in that an electrically conductive surface of the means of contact ( 2 ,  6 ), which, for purposes of electrochemical deposition of metal, cannot, or can almost not, be metalized in the electrolyte ( 12 ). 
     
     
         3 . Device according to  claim 1 , characterized in that an electrolyte supply device supplies an etching liquid ( 27 ) to the means of contact ( 2 ), consisting of flow elements as etching liquid pipes ( 21 ) having openings or nozzles ( 25 ) as well as at least one etching liquid pump and/or multi-way valves. 
     
     
         4 . Method for electrically contacting the material to be electroplated ( 1 ) by means of means of contact ( 2 ,  6 ) in electroplating systems of all kinds, whereby the cathodically polarized means of contact ( 2 ,  6 ) extend at least partially into the electrolyte ( 12 ) and electrically contact the material to be electroplated, by using the device according to  claim 1 , characterized in that the means of contact ( 2 ,  6 ) can be cooled directly or indirectly by means of a cooling medium or a cooling device so that metalization of the means of contact ( 2 ,  6 ) on the surface thereof is avoided in the electrolyte ( 12 ) used. 
     
     
         5 . Method according to  claim 4 , characterized in that electrochemical metalization of the means of contact ( 2 ,  6 ) in the electrolyte ( 12 ) used is avoided by means of a repellent property of the material of the contacting surface of the means of contact ( 2 ,  6 ). 
     
     
         6 . Method according to  claim 4 , characterized in that permanent metalization of the means of contact ( 2 ) is avoided by chemically etching the surface of the means of contact ( 2 ) by means of a chemically and/or physically conditioned etching liquid ( 27 ). 
     
     
         7 . Device for electrically contacting the material to be electroplated ( 1 ) through the means of contact ( 2 ,  6 ) in electroplating systems of all kinds, whereby the cathodically polarized means of contact ( 2 ,  6 ) extend at least partially into the electrolyte ( 12 ) and electrically contact the material to be electroplated, characterized in that a substance of at least the contacting surface of the means of contact ( 2 ,  6 ) cannot, or can almost not, be electrochemically metalized in the electrolyte ( 12 ) used. 
     
     
         8 . Device according to  claim 7 , characterized in that the means of contact ( 2 ,  6 ) can be cooled by means of a cooling device and/or a cooling medium. 
     
     
         9 . Device according to  claim 7 , characterized in that an electrolyte supply device supplies an etching liquid ( 27 ) to the means of contact ( 2 ), consisting of flow elements as etching liquid pipes ( 21 ) having openings or nozzles ( 25 ) and at least one etching liquid pump and/or multi-way valves. 
     
     
         10 . Method for electrically contacting material to be electroplated ( 1 ) through the means of contact ( 2 ,  6 ) in electroplating systems of all kinds, whereby the cathodically polarized means of contact ( 2 ,  6 ) extend at least partially into the electrolyte ( 12 ) and electrically contact the material to be electroplated, by using the device according to  claim 7 , characterized in that the property of the material of the means of contact ( 2 ,  6 ) in the electrolyte ( 12 ) used keeps the surface thereof free or virtually free from electrochemical metalization. 
     
     
         11 . Method according to  claim 10 , characterized in that the means of contact ( 2 ,  6 ) can be cooled directly or indirectly by means of a cooling medium or a cooling device so that their surface is kept free or virtually free from electrochemical metalization in the electrolyte ( 12 ) used. 
     
     
         12 . Method according to  claim 10 , characterized in that permanent metalization of the means of contact ( 2 ) is avoided by chemically etching the surface of the means of contact ( 2 ) by means of a chemically and/or physically conditioned etching liquid ( 27 ).