US2012241130A1PendingUtilityA1

Heat-dissipating base for electronic product

Assignee: HUANG HSIEN-NUNGPriority: Mar 22, 2011Filed: Mar 22, 2011Published: Sep 27, 2012
Est. expiryMar 22, 2031(~4.7 yrs left)· nominal 20-yr term from priority
G06F 1/203
12
PatentIndex Score
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Claims

Abstract

A heat-dissipating base for an electronic product includes a pair of supporting bodies and a concealed linkage assembly. The supporting bodies have a first accommodating trough provided with a first rail and a second accommodating trough provided with a second rail. The concealed linkage assembly is received in the first accommodating trough and the second accommodating trough. The concealed linkage assembly comprises a first connecting rod and a second connecting rod pivotally connected to each other. Both ends of the first connecting rod are pivotally connected to the pair of supporting bodies in the first accommodating trough and the second accommodating trough respectively. Both ends of the second connecting rod are slidingly connected to the first rail and the second rail respectively. By this structure, the present invention can be applied to various electronic products of different sizes, and it can be folded for easy storage and carry.

Claims

exact text as granted — not AI-modified
1 . A heat-dissipating base for an electronic product, including:
 a pair of supporting bodies respectively having a first accommodating trough and a second accommodating trough corresponding to each other, the first accommodating trough being provided with a first rail, the second accommodating rail being provided with a second rail; and   a concealed linkage assembly received in the first accommodating trough and the second accommodating trough, the concealed linkage assembly comprising a first connecting rod and a second connecting rod pivotally connected to each other, both ends of the first connecting rod being pivotally connected to the pair of supporting bodies in the first accommodating trough and the second accommodating trough respectively, both ends of the second connecting rod being slidingly connected to the first rail and the second rail respectively.   
     
     
         2 . The heat-dissipating base for an electronic product according to  claim 1 , wherein the first connecting rod has a plurality of first bars, the second connecting rod has a plurality of second bars, each of the first bars and each of the second bars are pivotally connected to each other to form an X-shaped structure. 
     
     
         3 . The heat-dissipating base for an electronic product according to  claim 1 , wherein each of the supporting bodies is formed into a trapezoid prism. 
     
     
         4 . The heat-dissipating base for an electronic product according to  claim 1 , further including two slide-proof pieces, each of the supporting bodies having a bottom surface, the slide-proof pieces being provided on the bottom surfaces respectively. 
     
     
         5 . The heat-dissipating base for an electronic product according to  claim 1 , further including two slide-proof pieces, each of the supporting bodies having a top surface, the slide-proof pieces being provided on the top surfaces respectively. 
     
     
         6 . The heat-dissipating base for an electronic product according to  claim 1 , wherein the first rail and the second rail are provided with a plurality of positioning portions respectively, both ends of the second connecting rod cooperate with the positioning portions to generate multi-stage adjustment. 
     
     
         7 . The heat-dissipating base for an electronic product according to  claim 1 , further including two protrusions, each of the supporting bodies having a top surface, the top surface being provided with a trough, each of the protrusions being pivotally connected to the supporting body in the trough, the two protrusions stopping the electronic product to be disposed on the two top surfaces. 
     
     
         8 . The heat-dissipating base for an electronic product according to  claim 1 , further including two supporting pieces, each of the supporting bodies having a bottom surface, the supporting pieces being pivotally connected to the bottom surfaces respectively. 
     
     
         9 . The heat-dissipating base for an electronic product according to  claim 8 , wherein each of the bottom surfaces is provided with a groove, each of the supporting pieces is pivotally connected to the supporting body in the groove. 
     
     
         10 . The heat-dissipating base for an electronic product according to  claim 9 , further including two adjustment pieces, a periphery of each groove being formed with a plurality of recesses, one end of each adjustment piece being pivotally connected to the supporting piece, the other end of each adjustment piece protruding to form a tenon, the tenon cooperating with the recesses to generate multi-stage adjustment. 
     
     
         11 . A heat-dissipating base for an electronic product, including:
 a pair of supporting bodies respectively having a first accommodating trough and a second accommodating trough corresponding to each other, the first accommodating trough being provided with a first rail, the second accommodating rail being provided with a second rail; and   a concealed linkage assembly received in the first accommodating trough and the second accommodating trough, the concealed linkage assembly comprising a first connecting rod and a second connecting rod pivotally connected to each other, one end of the first connecting rod being slidingly connected to the second rail, the other end of the first connecting rod being pivotally connected to one of the pair of supporting bodies in the first accommodating trough, one end of the second connecting rod being slidingly connected to the first rail, the other end of the second connecting rod being pivotally connected to the other of the pair of supporting bodies in the second accommodating trough.   
     
     
         12 . The heat-dissipating base for an electronic product according to  claim 11 , wherein the first connecting rod has a plurality of first bars, the second connecting rod has a plurality of second bars, each of the first bars and each of the second bars are pivotally connected to each other to form an X-shaped structure. 
     
     
         13 . The heat-dissipating base for an electronic product according to  claim 11 , wherein each of the supporting bodies is formed into a trapezoid prism. 
     
     
         14 . The heat-dissipating base for an electronic product according to  claim 11 , further including two slide-proof pieces, each of the supporting bodies having a bottom surface, the slide-proof pieces being provided on the bottom surfaces respectively. 
     
     
         15 . The heat-dissipating base for an electronic product according to  claim 11 , further including two slide-proof pieces, each of the supporting bodies having a top surface, the slide-proof pieces being provided on the top surfaces respectively. 
     
     
         16 . The heat-dissipating base for an electronic product according to  claim 11 , wherein the first rail and the second rail are provided with a plurality of positioning portions respectively, one end of the first connecting rod and one end of the second connecting rod cooperate with the positioning portions to generate multi-stage adjustment. 
     
     
         17 . The heat-dissipating base for an electronic product according to  claim 11 , further including two protrusions, each of the supporting bodies having a top surface, the top surface being provided with a trough, each of the protrusions being pivotally connected to the supporting body in the trough, the two protrusions stopping the electronic product to be disposed on the two top surfaces. 
     
     
         18 . The heat-dissipating base for an electronic product according to  claim 11 , further including two supporting pieces, each of the supporting bodies having a bottom surface, the supporting pieces being pivotally connected to the bottom surfaces respectively. 
     
     
         19 . The heat-dissipating base for an electronic product according to  claim 18 , wherein each of the bottom surfaces is provided with a groove, each of the supporting pieces is pivotally connected to the supporting body in the groove. 
     
     
         20 . The heat-dissipating base for an electronic product according to  claim 19 , further including two adjustment pieces, a periphery of each groove being formed with a plurality of recesses, one end of each adjustment piece being pivotally connected to the supporting piece, the other end of each adjustment piece protruding to form a tenon, the tenon cooperating with the recesses to generate multi-stage adjustment.

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