Heat pump system
Abstract
One aspect of the present invention may include a heat pump system having a Peltier unit in an outdoor space and an outdoor heat exchange unit in the outdoor space. The Peltier unit has a Peltier element with a heat-absorbing portion and a heat-radiating portion, a first substrate in contact with the heat-absorbing portion, a second substrate in contact with the heat-radiating portion, a metal case and a resin case. The metal case covers the first substrate and forms a first flow path between itself and the first substrate. The first flow path is connected in a loop-like fashion to the outdoor heat exchange unit by an outdoor piping. The resin case covers the second substrate and forms a second flow path between itself and the second substrate. The second flow path is connected in a loop-like fashion to the indoor heat exchange unit by an indoor piping.
Claims
exact text as granted — not AI-modified1 . A heat pump system comprising:
a Peltier unit installed in an outdoor space; an outdoor heat exchange unit installed in the outdoor space and connected to the Peltier unit via an outdoor piping in a loop-like fashion to effect heat exchange with air in the outdoor space; and an indoor heat exchange unit provided in an indoor space and connected to the Peltier unit in a loop-like fashion by an indoor piping to effect heat exchange with air in the indoor space, wherein the Peltier unit comprises:
a Peltier element equipped with a first heat surface and a second heat surface, one of the surfaces constituting a heat-absorbing portion, one of the surfaces constituting a heat-radiating portion,
a first substrate being in contact with the first heat surface,
a second substrate being in contact with the second heat surface,
a metal case covering the first substrate and forming a first flow path between the metal case and the first substrate, the first flow path connected in a loop-like fashion to the outdoor heat exchange unit by the outdoor piping, and
a resin case covering the second substrate and forming a second flow path between the resin case and the second substrate, the second flow path connected in a loop-like fashion to the indoor heat exchange unit by the indoor piping.
2 . A heat pump system as in claim 1 , further comprising a heat generating body mounted to the metal case so as to allow heat exchange,
wherein an electric current is supplied to the Peltier element such that the first heat surface of the Peltier element constitutes the heat-absorbing portion.Join the waitlist — get patent alerts
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