Cooling unit and electronic apparatus system

Abstract

A cooling unit includes a cooling member cooled by a cooling body, a plurality of heat transfer members, and a support member. Each of the plurality of heat transfer members has a first contact portion and a second contact portion, the first contact portion being configured to come into contact with the cooling member, the second contact portion being configured to come into contact with a target to be cooled. The support member supports the plurality of heat transfer members at positions distant from the cooling member so that each of the plurality of heat transfer members is independently movable to be in contact with the cooling member.

1 . A cooling unit comprising:
 a cooling member cooled by a cooling body;   a plurality of heat transfer members, each of the plurality of heat transfer members having a first contact portion and a second contact portion, the first contact portion being configured to come into contact with the cooling member, the second contact portion being configured to come into contact with a target to be cooled; and   a support member that supports the plurality of heat transfer members at positions distant from the cooling member so that each of the plurality of heat transfer members is independently movable to be in contact with the cooling member.   
     
     
         2 . The cooling unit according to  claim 1 , further comprising:
 a heat insulating member that thermally isolates the cooling member.   
     
     
         3 . The cooling unit according to  claim 1 ,
 wherein the support member thermally isolates the cooling member.   
     
     
         4 . The cooling unit according to  claim 3 ,
 wherein the support member forms a sealed spacing between the cooling member and the plurality of heat transfer members.   
     
     
         5 . The cooling unit according to  claim 2 ,
 wherein the heat insulating member includes an isolating case accommodating the cooling member, the isolating case having a hole that passes through the isolating case in a direction in which the plurality of heat transfer members move toward and away from the cooling member, and   wherein the plurality of heat transfer members are disposed inside an outer periphery of the hole.   
     
     
         6 . The cooling unit according to  claim 2 ,
 wherein the heat insulating member includes an insulating layer disposed on a surface of the cooling member and having a plurality of through-holes, the surface facing the plurality of heat transfer members, each of the plurality of through-holes being formed at a position corresponding to one of the plurality of heat transfer members, and   wherein the support member includes a plurality of thermally insulative support bodies supporting the plurality of heat transfer members, each of the plurality of thermally insulative support bodies being formed so as to enclose a periphery of one of the plurality of through-holes and forming an individual sealed spacing between the cooling member and the one of the plurality of heat transfer members.   
     
     
         7 . The cooling unit according to  claim 2 ,
 wherein the heat insulating member includes an insulating layer disposed on a surface of the cooling member and having a plurality of through-holes, the surface facing the plurality of heat transfer members, each of the plurality of through-holes being formed at a position corresponding to one of the plurality of heat transfer members, and   wherein the support member includes a thermally insulative support body supporting the plurality of heat transfer members, the thermally insulative support body being disposed at an opposite side of the insulating layer from the cooling member at a distance from the insulating layer and forming a sealed spacing between the cooling member and the plurality of heat transfer members.   
     
     
         8 . An electronic apparatus system comprising:
 an electronic apparatus that is a target to be cooled; and   a cooling unit that includes:
 a cooling member cooled by a cooling body, 
 a plurality of heat transfer members, each of the plurality of heat transfer members having a first contact portion and a second contact portion, the first contact portion being configured to come into contact with the cooling member, the second contact portion being configured to come into contact with the electronic apparatus, and 
 a support member that supports the plurality of heat transfer members at positions distant from the cooling member so that each of the plurality of heat transfer members is independently movable to be in contact with the cooling member. 
   
     
     
         9 . The electronic apparatus system according to  claim 8 , the cooling unit further including a heat insulating member that thermally isolates the cooling member. 
     
     
         10 . The electronic apparatus system according to  claim 8 ,
 wherein the support member thermally isolates the cooling member.   
     
     
         11 . The electronic apparatus system according to  claim 10 ,
 wherein the support member forms a sealed spacing between the cooling member and the plurality of heat transfer members.   
     
     
         12 . The electronic apparatus system according to  claim 9 ,
 wherein the heat insulating member includes an isolating case accommodating the cooling member, the isolating case having a hole that passes through the isolating case in a direction in which the plurality of heat transfer members move toward and away from the cooling member, and   wherein the plurality of heat transfer members are disposed inside an outer periphery of the hole.   
     
     
         13 . The electronic apparatus system according to  claim 9 ,
 wherein the heat insulating member includes an insulating layer disposed on a surface of the cooling member and having a plurality of through-holes, the surface facing the plurality of heat transfer members, each of the plurality of through-holes being formed at a position corresponding to one of the plurality of heat transfer members, and   wherein the support member includes a plurality of thermally insulative support bodies supporting the plurality of heat transfer members, each of the plurality of thermally insulative support bodies being formed so as to enclose a periphery of one of the plurality of through-holes and forming an individual sealed spacing between the cooling member and the one of the plurality of heat transfer members.   
     
     
         14 . The electronic apparatus system according to  claim 9 ,
 wherein the heat insulating member includes an insulating layer disposed on a surface of the cooling member and having a plurality of through-holes, the surface facing the plurality of heat transfer members, each of the plurality of through-holes being formed at a position corresponding to one of the plurality of heat transfer members, and   wherein the support member includes a thermally insulative support body supporting the plurality of heat transfer members, the thermally insulative support body being disposed at an opposite side of the insulating layer from the cooling member at a distance from the insulating layer and forming a sealed spacing between the cooling member and the plurality of heat transfer members.