US2012222842A1PendingUtilityA1
Heat dissipation module
Est. expiryMar 1, 2031(~4.6 yrs left)· nominal 20-yr term from priority
Inventors:Chih-Jen Chou
H10W 40/251H10W 40/43H10W 40/257
12
PatentIndex Score
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Claims
Abstract
A heat dissipation module, which comprises a heat dissipation piece, a fan, a heat conduction coating material and a heat conduction piece, is disclosed. The heat conduction coating material is used for improving the thermal radiation coefficient of the heat dissipation piece. Accordingly, when elements transmit heat to the heat dissipation piece via the heat conduction piece, more heat is transmitted to the air via thermal radiation manner. Next, the fan sucks heated air to achieve the effect of heat dissipation.
Claims
exact text as granted — not AI-modified1 . A heat dissipation module comprising:
a heat dissipation piece; a heat conduction piece located on a surface of the heat dissipation piece, wherein a heating element is disposed on the heat conduction piece; a heat conduction coating material formed on the heat dissipation piece to improve a thermal radiation coefficient of the heat dissipation piece; and a fan disposed to a side of the heat dissipation piece to suck the air to dissipate heat generated by the heating element.
2 . The heat dissipation module as recited in claim 1 , further comprising a first heat conduction foam disposed on the heat conduction coating material.
3 . The heat dissipation module as recited in claim 2 , further comprising a second heat conduction foam disposed on the heat conduction coating material, wherein the second heat conduction foam and the first heat conduction foam form an air channel.
4 . The heat dissipation module as recited in claim 1 , wherein the fan is further disposed with an air outlet and an air inlet for sucking and expelling the air.
5 . The heat dissipation module as recited in claim 4 , wherein a temperature of the air is 75 degrees Celsius.
6 . The heat dissipation module as recited in claim 1 , wherein the thermal radiation coefficient of the heat dissipation piece having the heat conduction coating material is larger than 0.95.
7 . The heat dissipation module as recited in claim 1 , wherein the heat dissipation piece is a flat plate.
8 . The heat dissipation module as recited in claim 1 , wherein a material of the heat dissipation piece is metal.
9 . The heat dissipation module as recited in claim 1 , wherein the heat conduction coating material is formed on the heat dissipation piece by spray coating or printing manner.
10 . The heat dissipation module as recited in claim 1 , wherein the heat dissipation piece is a predetermined-shape-heat-dissipation-piece.
11 . The heat dissipation module as recited in claim 10 , wherein a shape of the predetermined-shape-heat-dissipation-piece is a tree like, a paw like or an arc segment like.
12 . The heat dissipation module as recited in claim 1 , wherein the heat generated by the heating element is transmitted to the heat dissipation piece via the heat conduction piece.Join the waitlist — get patent alerts
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