Heat dissipating device

Abstract

A heat dissipating device includes a heat sink, two support arms, two securing units, four first fasteners, and four second fasteners. The two support arms are attached to the heat sink. Each of the support arms defines a groove and a first slot. Each of the securing units includes a sliding arm and a fixing arm. The sliding arm defines a receiving recess and a second slot. The fixing arm defines a third slot. The sliding arm is configured for moving the fixing arm toward or away from the heat sink to align the third slot with mounting holes of a motherboard. The first fasteners fix the two fixing arms on the circuit board. The second fasteners are engagingly received in the communicating first and second slots to fixedly attach the two sliding arms to the two support arms.

1 . A heat dissipating device for dissipating heat from a heat radiation element mounted on a circuit board, the circuit board having a mounting surface and at least one mounting hole defined in the mounting surface, the heat dissipating device comprising:
 a heat sink for being arranged on the heat radiation element;   at least one support arm attached to the heat sink, each of the at least one support arm defining a groove and a first slot communicating with the groove;   at least one securing unit, each of the at least one securing unit comprising a sliding arm and a fixing arm connected to the sliding arm, the sliding arm defining a receiving recess and a second slot communicating with the receiving recess, the fixing arm defining a third slot, the sliding arm being slidably engaged in the groove of a corresponding one of the at least one support arm, and the sliding arm being configured for moving the fixing arm toward or away from the heat sink to align the third slot of the fixing arm with a corresponding one of the at least one mounting hole, with the first slot of the corresponding support arm communicating with the second slot of the sliding arm;   at least one first fastener, each first fastener configured for being received in the third slot of a corresponding fixing arm and a corresponding mounting hole to fix the corresponding fixing arm on the circuit board; and   at least one second fastener, each second fastener configured for being received in the first slot of a corresponding supporting arm and the second slot of a corresponding sliding arm to attach the corresponding sliding arm to the corresponding support arm.   
     
     
         2 . The heat dissipating device of  claim 1 , wherein the sliding arm and the fixing arm of each securing unit are substantially perpendicular to each other. 
     
     
         3 . The heat dissipating device of  claim 2 , wherein the at least one support arm comprises two support arms arranged at opposite ends of the heat sink, the at least one securing unit comprises two securing units arranged around the heat sink. 
     
     
         4 . The heat dissipating device of  claim 3 , wherein the two grooves of the two support arms are substantially parallel to each other. 
     
     
         5 . The heat dissipating device of  claim 1 , wherein the heat sink comprises a base and a plurality of fins protruding from the base, the base is configured for being arranged on the heat radiation element. 
     
     
         6 . The heat dissipating device of  claim 1 , further comprising a support board for being arranged at a side of the circuit board facing away from the heat sink, wherein the support board comprises a frame and defining a receiving hole in the frame, each of the at least one first fastener comprises a first screw bolt and a first screw nut, the first screw bolt is configured for passing through a corresponding third slot and a corresponding mounting hole, the first screw nut is configured for engaging with the first screw bolt and pushing the frame of the support board to contact the circuit board. 
     
     
         7 . The heat dissipating device of  claim 6 , wherein the first screw bolt is arranged along a direction substantially perpendicular to the mounting surface of the circuit board. 
     
     
         8 . The heat dissipating device of  claim 1 , wherein each of the at least one second fastener comprises a second screw bolt and a second screw nut, the second screw bolt is configured for passing through the first slot of a corresponding supporting arm and the second slot of a corresponding sliding arm, the second screw nut is configured for being received in the receiving recess of the corresponding sliding arm and engaging with the screw bolt. 
     
     
         9 . The heat dissipating device of  claim 8 , wherein the second screw bolt is arranged along a direction substantially parallel to the mounting surface of the circuit board. 
     
     
         10 . The heat dissipating device of  claim 1 , further comprising a fan, the fan being arranged adjacent to the heat sink and configured for providing air flows to the heat sink.