Method and system for preparing wireless communication chips for later processing

Abstract

A method for manufacturing wireless communication devices for use in tracking or identifying other items comprises a number of cutting techniques that allow the size of the antenna for the wireless communication device. Further, the chip for the wireless communication device is nested so as to be flush with the surface of the substrate of the wireless communication device. Rollers cut the tabs that form the antenna elements. In a first embodiment, a plurality of rollers is used, each one effecting a different cut whose position may be phased so as to shorten or lengthen the antenna element. In a second embodiment, the rollers are independently positionable to shorten or lengthen the antenna element.

1 . A method of preparing an antenna for use on a wireless communication device, the method comprising:
 passing a metal foil through a pair of rollers, wherein one of the pair of rollers is a die cut roller;   die-cutting the metal foil with the die cut roller into a pair of antenna tabs; and   passing the antenna tabs downstream for securement to a substrate.   
     
     
         2 . The method of  claim 1 , wherein said passing the antenna tabs downstream for securement to a substrate comprises passing the antenna tabs downstream to form an antenna on the wireless communication device. 
     
     
         3 . The method of  claim 1 , further comprising determining dimensions of the antenna tabs based on an electrical characteristic of the substrate. 
     
     
         4 . The method of  claim 1 , further comprising determining the dimensions of the antenna tabs based on a signal read range at a desired operating frequency. 
     
     
         5 . The method of  claim 1 , wherein said passing the antenna tabs downstream for securement to a substrate comprises:
 creating fingers on the antenna tabs;   heating pins of a wireless communication chip; and   inserting the pins of the wireless communication chip into the substrate such that the fingers on the antenna tabs wrap around the pins.   
     
     
         6 . The method of  claim 1 , wherein said passing the antenna tabs downstream for securement to a substrate comprises welding pins of a wireless communication chip to the antenna tabs. 
     
     
         7 . The method of  claim 6 , wherein said welding pins of a wireless communication chip to the antenna tabs comprises welding the pins of the wireless communication chip with a low voltage, high current electrical pulse. 
     
     
         8 . The method of  claim 7 , wherein said welding the pins of the wireless communication chip with a low voltage, high current electrical pulse comprises passing the low voltage, high current electrical pulse through the pins of the wireless communication chip.