Method of manufacturing cards that each include an electronic module and intermediate products

Abstract

A method of manufacturing a card including an electronic module provides a frame or plate having at least one aperture for receiving the electronic module, is characterized in that at least one part of the peripheral area of at least one aperture is deformed to locally reduce the thickness of the frame in the at least one part of the peripheral area, in that the electronic module is brought opposite the corresponding aperture so that at least one zone of the electronic module is superposed on the at least one part of the peripheral area, and in that a connection is established between the at least one part of the peripheral area and the at least one corresponding zone of the electronic module for assembling the electronic module to the frame before a resin is added at least on one side of the electronic module.

1 - 31 . (canceled) 
     
     
         32 . An assembly forming an intermediate product involved in a card manufacture method in which this assembly is at least partially covered by a filling material or a resin so as to form with this filling material or resin a layer of the cards, said assembly comprising:
 a plate having one or several through apertures,   one or several electronic module(s) disposed in said through aperture(s) which has or each have a space open at least on one side of said plate,   each electronic module having at least one zone materially connected to at least one part of a peripheral area of a corresponding aperture in the plate,   said at least one zone and said at least one part forming a material connection between said electronic module and said plate and wherein   said at least one part of the peripheral area of each through aperture defines a step with a smaller thickness than that of said plate.   
     
     
         33 . The assembly according to  claim 32 , wherein each aperture in said plate has first dimensions, and a first profile and each electronic module has second dimensions and a second profile, which are such that at least two distinct zones of the edge of said electronic module are superposed on at least two corresponding parts of said peripheral area of the corresponding aperture, said two parts being deformed or crushed by pressure, each zone and the corresponding part jointly forming a material connection between said electronic module and said plate and thus positioning the electronic module relative to said plate, and wherein a slot located along said each of each electronic module is provided between the material connections. 
     
     
         34 . The assembly according to  claim 33 , wherein said slot is provided along said edge of edge electronic module. 
     
     
         35 . The assembly according to  claim 32 , wherein an adhesive film is deposited between said at least one zone of the electronic module and said at least one corresponding part of said peripheral area, said adhesive film forming an adherent interface. 
     
     
         36 . The assembly according to  claim 32 , wherein the thickness of said plate is approximately equal to a maximum height of the electronic module(s), each module being approximately located entirely inside the corresponding aperture in said plate. 
     
     
         37 . An intermediate product involved in the manufacture of cards in which this intermediate product forms an intermediate layer between external layers, said intermediate product comprising:
 a plate having one or several through apertures,   one or several electronic module(s) disposed in said through aperture(s), which has/have each a space open at least on one side of said plate, and of a filling material or resin which fills said remaining space in each aperture,   wherein each electronic module has at least one zone materially connected to at least one part of the peripheral area of a corresponding aperture in the plate, said at least one zone and said at least one corresponding part together forming a material connection between said electronic module and said plate, and   wherein said at least one part of the peripheral area of each through aperture defines a step with a smaller thickness than that of said plate.   
     
     
         38 . The intermediate product according to  claim 37 , wherein each aperture has first dimensions and a first profile and each electronic module has second dimensions and a second profile, which are such that at least two distinct zones of said edge of said electronic module are superposed on at least two corresponding parts of said peripheral area of the corresponding aperture, said two parts being deformed by pressure, each zone and the corresponding part jointly forming a material connection between said electronic module and said plate and precisely positioning said electronic module relative to said plate, and wherein a slot located along said edge of each electronic module is provided between the material connections, this slot being filled by said filling material. 
     
     
         39 . The intermediate product according to  claim 38 , wherein said slot is provided along said edge of each electronic module. 
     
     
         40 . The intermediate product according to  claim 37 , wherein an adhesive film is deposited between said at least one zone of the electronic module and said at least one corresponding part of said peripheral area, said adhesive film forming an adherent interface. 
     
     
         41 . The intermediate product according to  claim 37 , wherein the thickness of said plate is approximately equal to a maximum height of the electronic module(s), each module being disposed inside the corresponding aperture in said plate. 
     
     
         42 . The intermediate product according to  claim 37 , wherein said filling material comprises a resin that adheres securely to PVC materials, said resin further covering the bottom surface and the top surface of said plate. 
     
     
         43 . The intermediate product according to  claim 38 , wherein said filling material comprises a resin that adheres securely to PVC materials, said resin further covering the bottom surface and the top surface of said plate. 
     
     
         44 . The intermediate product according to  claim 38 , wherein the thickness of said plate is approximately equal to the maximum height of the electronic module(s), each module being located at least inside the corresponding aperture in said plate. 
     
     
         45 . The intermediate product according to  claim 38 , wherein an adhesive film is deposited between said at least one zone of the electronic module and said at least one corresponding part of said peripheral area, said adhesive film comprising an adherent interface. 
     
     
         46 . The assembly according to  claim 33 , wherein the thickness of said plate is approximately a maximum height of the electronic module(s), each module being at least inside the corresponding aperture in said plate. 
     
     
         47 . The assembly according to  claim 33 , wherein an adhesive film is deposited between said at least one zone of the electronic module and said at least one corresponding part of said peripheral area, said adhesive film comprising an adherent interface.