Single-package wireless communication device

Abstract

A method, apparatus and system with an autonomic, self-healing polymer capable of slowing crack propagation within the polymer and slowing delamination at a material interface.

1 . A system comprising:
 a mass storage device coupled to an integrated circuit package including a radio frequency transceiver, wherein the radio frequency transceiver includes:   an antenna,   a first die including a radio frequency integrated circuit electrically coupled to the front end module,   a second die including a base band communication processor electrically coupled to the radio frequency integrated circuit; and   a third die including a front end module for processing radio frequency signals, coupled to the antenna, wherein the front end module includes a low noise amplifier, a power amplifier, and a switch.   
     
     
         2 . The system of  claim 1  wherein:
 the radio frequency transceiver is capable of communicating according to a wireless standard used substantially for a selected one of the group consisting of a personal area network, a local area network, a metropolitan area network, a wide area network, and a combination thereof. 
 
     
     
         3 . The system of  claim 1 , further comprising:
 an application processor coupled to the base band communication processor;   a memory coupled to the application processor; and   an input/output interface coupled to the application processor.   
     
     
         4 . The system of  claim 3 , wherein:
 the input/output interface comprises a user interface.   
     
     
         5 . The system of  claim 1 , wherein:
 the radio frequency integrated circuit can receive an input signal from a global positioning system receiver.   
     
     
         6 . The system of  claim 4 , wherein:
 the system is a selected one of a group comprising a set-top box, a media-center personal computer, a digital versatile disk player, a server, a personal computer, a mobile personal computer, a network router, a handheld device, and a network switching device.   
     
     
         7 . A method comprising:
 soldering a first die to a substrate, wherein the substrate includes a first layer with electrical traces that partially form an integrated circuit on the substrate and a second layer substantially formed of dielectric material and the first die includes a first integrated circuit;   mechanically coupling a second die that includes a second integrated circuit to a second side of the first die substantially parallel to the first side of the first die, such that the first die is disposed between the substrate and the second die; and   electrically coupling the second die through wire bonds to the integrated circuit on the substrate.   
     
     
         8 . The method of  claim 7  further comprising:
 forming an antenna electrically coupled to the integrated circuit on the substrate; and 
 soldering a third die, including a third integrated circuit, to the integrated circuit on the substrate by means of an array of solder bumps, wherein the antenna and first, second, and third integrated circuits substantially form a radio transceiver. 
 
     
     
         9 . The method of  claim 7  wherein:
 the second integrated circuit further comprises a base band communication processor. 
 
     
     
         10 . The method of  claim 7  further comprising:
 coupling a third die that includes a third integrated circuit forming a memory device to the second die prior to mechanically coupling the second die to the first die. 
 
     
     
         11 . The method of  claim 7  further comprising:
 forming an electrical connection upon reflow of two or more solder balls that collapse and coalesce, wherein the electrical connection has a larger cross-sectional area than a single constituent solder ball. 
 
     
     
         12 . The method of  claim 8  wherein:
 the radio frequency transceiver is capable of communicating according to a wireless standard used substantially for a selected one of the group consisting of a personal area network, a local area network, a metropolitan area network, a wide area network, and a combination thereof. 
 
     
     
         13 . The method of  claim 8 , wherein:
 the third die is formed substantially of a selected one chosen from the group consisting of gallium arsenide, silicon on sapphire, and silicon germanium.