Method of making a multilayer composite

Abstract

A method for providing a multilayer composite includes the steps of providing a first composite comprising a film of a dielectric material with a front surface and an opposite rear surface, the front surface comprising a surface pattern; depositing an electrically conductive layer onto the surface pattern; providing a second composite comprising a film with a front surface and an opposite rear surface, the front surface comprising a surface pattern; depositing an electrically conductive layer covering at least a portion of the surface pattern; arranging the first composite on the second composite; and fixating the position of the first composite relative to the second composite.

1 . A method of making a multilayer composite, the method comprising:
 providing a shape defining element having a surface pattern of raised and depressed surface portions,   providing a liquid polymer composition onto the surface pattern,   curing the liquid polymer composition to form a first film having a surface with a replicated pattern of raised and depressed surface portions,   coating at least a portion of the replicated pattern with a first electrically conductive layer,   providing a liquid polymer composition directly onto the first film or onto the electrically conductive layer to provide a second film,   pre-curing the liquid polymer composition,   embossing a shape defining element into the second film to provide a second replicated pattern,   curing the polymer composition of the second film, and   coating at least a portion of the second replicated pattern with a second electrically conductive layer.   
     
     
         2 . The method according to  claim 1 , wherein at least the steps of:
 providing a liquid polymer composition directly onto a film or onto an electrically conductive layer of the multilayer composite to provide another film,   pre-curing the liquid polymer composition,   embossing a shape defining element into the second film to provide another replicated pattern,   curing the polymer composition of the second film, and   coating at least a portion of the replicated pattern with an electrically conductive layer,   
       is repeated to provide a plurality of layers in the multilayer composite. 
     
     
         3 . The method according to  claim 1 , wherein the step of providing a shape defining element is repeated with elements having different surface patterns. 
     
     
         4 . The method according to  claim 1 , wherein the step of coating at least a portion of the replicated pattern with a first electrically conductive layer comprises the step of using a shape of the first film to shape the electrically conductive layer. 
     
     
         5 . The method according to  claim 1 , wherein the electrically conductive layer is deposited on the film in a physical vapour deposition process. 
     
     
         6 . The method according to  claim 1 , wherein the electrically conductive layer is deposited onto the film in a thickness of 0.01-0.1 μm. 
     
     
         7 . The method according to  claim 6 , wherein the thickness is controlled by quartz crystal micro balance. 
     
     
         8 . The method according to  claim 6 , wherein the electrically conductive layer is deposited in a sputtering process. 
     
     
         9 . The method according to  claim 6 , wherein the electrically conductive layer is deposited in an electron beam process. 
     
     
         10 . The method according to  claim 1 , wherein the at least one of the first film or second film is treated with a plasma to improve adhesion of the electrically conductive layer. 
     
     
         11 . The method according to  claim 10 , wherein the treatment is conducted with a glow discharge which is known to generate mild plasma. 
     
     
         12 . The method according to  claim 10 , wherein an adhesion promoter is applied to at least said portion of the replicated pattern after the step of plasma treating and before the step of coating the electrically conductive layer thereon. 
     
     
         13 . The method according to  claim 12 , wherein the adhesion promoter is provided by applying a layer of chromium or titanium between the film and the electrically conductive layer. 
     
     
         14 . The method according to  claim 12 , wherein the adhesion promoter is applied to the film in a physical vapour deposition process.