Thermal control device

Abstract

The invention refers to a thermal control device for controlling the temperature of a heat source by means of transferring heat from the heat source to the ambient environment, through the circulation of a fluid in the device, said device comprising an evaporator ( 10 ) collecting heat from the heat source, a condenser ( 30 ) rejecting heat to the ambient environment, a compensation chamber ( 20 ), and liquid ( 50 ) and vapor ( 40 ) transport lines connecting the evaporator ( 10 ) and the condenser ( 30 ), the fluid flowing through said transport lines ( 40, 50 ), the device further comprising a thermal electrical cooler ( 90 ), the thermal electrical cooler ( 90 ) further comprising a thermal saddle ( 80 ) attached to the cold side of the thermal electrical cooler ( 90 ), and a thermal radiator ( 100 ) attached to the hot side of the thermal electrical cooler ( 90 ), such that heat is rejected to the ambient environment directly through the thermal radiator ( 100 ), when the thermal control device operates in a hot environment, the ambient temperature surrounding the liquid transport line ( 50 ) being higher than the temperature of liquid in the exit ( 110 ) of the condenser ( 30 ).

1 . Thermal control device for controlling the temperature of a heat source by means of transferring heat from the heat source to the ambient environment, through the circulation of a fluid in the device, said device comprising an evaporator ( 10 ) collecting heat from the heat source, a condenser ( 30 ) rejecting heat to the ambient environment, a compensation chamber ( 20 ), and liquid ( 50 ) and vapor ( 40 ) transport lines connecting the evaporator ( 10 ) and the condenser ( 30 ), the fluid flowing through said transport lines ( 40 ,  50 ), characterized in that the device further comprises a thermal electrical cooler ( 90 ), the thermal electrical cooler ( 90 ) further comprising a thermal saddle ( 80 ) attached to the cold side of the thermal electrical cooler ( 90 ), and a thermal radiator ( 100 ) attached to the hot side of the thermal electrical cooler ( 90 ), such that heat is rejected to the ambient environment directly through the thermal radiator ( 100 ), when the thermal control device operates in a hot environment, the ambient temperature surrounding the liquid transport line ( 50 ) being higher than the temperature of liquid in the exit ( 110 ) of the condenser ( 30 ). 
     
     
         2 . Thermal control device according to  claim 1 , wherein the thermal electrical cooler ( 90 ) is located in the liquid transport line ( 50 ) close to the compensation chamber ( 20 ). 
     
     
         3 . Thermal control device according to  claim 1 , wherein the thermal electrical cooler ( 90 ) is located on the compensation chamber ( 20 ). 
     
     
         4 . Thermal control device according to  claim 2 , wherein the thermal saddle ( 80 ) comprises a metallic rectangular plate with an orifice inside it for the liquid transport line ( 50 ). 
     
     
         5 . Thermal control device according to  claim 3 , wherein the thermal saddle ( 80 ) comprises a rectangular plate having one flat side for being attached to the thermal electrical cooler ( 90 ), and a cylindrical opposite side for attaching the thermal electrical cooler ( 90 ) to the compensation chamber ( 20 ) with the same diameter as it. 
     
     
         6 . Thermal control device according to  claim 4 , wherein the thermal saddle ( 80 ) is made of a metal having a high thermal conductance. 
     
     
         7 . Thermal control device according to  claim 6 , wherein the thermal saddle ( 80 ) is made of aluminum. 
     
     
         8 . Thermal control device according to  claim 1 , wherein the thermal electrical cooler ( 90 ) comprises a hot plate and a cold plate, having different electrical polarity. 
     
     
         9 . Thermal control device according to  claim 1 , wherein the thermal electrical cooler ( 90 ) further comprises a fan to facilitate heat rejection. 
     
     
         10 . Method to increase thermal conductivity of a thermal control device according to  claim 1  working in a hot environment, the ambient temperature surrounding the liquid transport line ( 50 ) being higher than the temperature of liquid in the exit ( 110 ) of the condenser ( 30 ), wherein the method comprises the steps of cooling of the thermal control device by means of the thermal electrical cooler ( 90 ), and removing heat, obtained by liquid inside of the liquid transport line ( 50 ) or by compensation chamber ( 20 ) from the hot environment, by means of the thermal electrical cooler ( 90 ) from the liquid transport line ( 50 ) or compensation chamber ( 20 ), and heat released by the thermal electrical cooler ( 90 ) itself, this heat being directly rejected to the ambient environment outside the thermal control device and hot environment. 
     
     
         11 . Method according to  claim 10 , wherein the cooling of the thermal control device is made in the liquid transport line ( 50 ) close to the compensation chamber ( 20 ). 
     
     
         12 . Method according to  claim 10 , wherein the cooling of the thermal control device is made in the compensation chamber ( 20 ).