Methods and devices for enhancing chemical mechanical polishing pad processes

Abstract

The present invention discloses a CMP device and methods that are capable of improving CMP processing through incorporation of vibration sources which produce vibrations in a direction substantially parallel to the working surface of the CMP pad. The CMP device includes a CMP pad dresser. Such a method can include steps of vibrating a CMP pad, CMP pad dresser, or wafer in a direction substantially parallel to a working surface of the CMP pad and engaging the CMP pad dresser with a working surface of a CMP pad The results of vibrating the superabrasive particles can provide benefits to both the CMP pad and dresser, according to several aspects disclosed herein.

1 . A CMP pad dresser device, comprising:
 a substrate member having a working surface;   a plurality of superabrasive particles coupled to the working surface of the substrate member; and   at least one vibrator coupled to the CMP pad dresser at a location that vibrates the dresser in a direction substantially parallel to a working surface of a CMP pad with which the CMP pad dresser is engaged.   
     
     
         2 . The device of  claim 1 , wherein the vibrator is an ultrasonic transducer. 
     
     
         3 . The device of  claim 2 , wherein the ultrasonic transducer comprises a piezoelectric material. 
     
     
         4 . The device of  claim 2 , wherein the vibrator comprises a solenoid. 
     
     
         5 . The device of  claim 1 , wherein the vibrator controls vibration direction. 
     
     
         6 . The device of  claim 2 , wherein the vibrator vibrates the CMP pad dresser at an ultrasonic frequency greater than 15 kHz. 
     
     
         7 . The device of  claim 1 , wherein the superabrasive particles are selected from a group consisting of diamond, diamond-like carbon, polycrystalline diamond (PCD), cubic boron nitride (cBN), and polycrystalline cubic boron nitride (PCBN). 
     
     
         8 . The device of  claim 1 , wherein the superabrasive particles are arranged in a predetermined pattern on the working surface of the substrate member. 
     
     
         9 . The device of  claim 8 , wherein the predetermined pattern is substantially uniform. 
     
     
         10 . The device of  claim 1 , wherein the superabrasive particles extend to a predetermined height above the substrate member. 
     
     
         11 . The device of  claim 10 , wherein the predetermined height provides troughs of corresponding depth in the CMP pad. 
     
     
         12 . The device of  claim 1 , wherein the substrate member is a metallic material. 
     
     
         13 . The device of  claim 1 , wherein the substrate member is an organic material. 
     
     
         14 . The device of  claim 1 , further comprising an amplifier. 
     
     
         15 . The device of  claim 1 , further comprising a damping plate. 
     
     
         16 . The device of  claim 1 , wherein the at least one vibrator is attached to the CMP pad dresser at a periphery of the substrate member. 
     
     
         17 . The device of  claim 1 , wherein the at least one vibrator is coupled to the CMP pad dresser at a location on the substrate member and opposite of the working surface of the substrate member. 
     
     
         18 . A CMP pad device, comprising:
 a substrate member having a working surface;   a CMP pad dresser optionally engaged with at least a portion of the working surface; and   at least one vibrator coupled to the CMP pad at a location that vibrates the pad in a direction substantially parallel to a working surface of the working surface.   
     
     
         19 . A method of minimizing a drag coefficient on superabrasive particles of a CMP pad dresser during a CMP pad conditioning process, comprising:
 vibrating, in a direction substantially parallel to a working surface of the CMP pad, a member selected from the CMP pad, the CMP pad dresser, a wafer being polished by the CMP pad, or a combination thereof; and   engaging the CMP pad dresser with a working surface of the CMP pad such that oscillation between the CMP pad dresser and the CMP pad occurs in a direction substantially parallel to a working surface of the CMP pad.