Optical device inspecting apparatus

Abstract

To provide an optical device inspecting apparatus which can be set to take many objects at one time more freely compared with conventional apparatuses, and can accurately inspect even an optical device wherein an optical sensor is offset from a microlens. Provided is an optical device inspecting apparatus having a probe card unit and a lens unit. The probe card unit is provided with a main substrate, a guide plate and a probe. The guide plate is provided with a plurality of probe inserting holes. The probe is inserted into the probe inserting hole on the guide plate and fixed. The leading end portion of the probe protruding from the inserting hole has a shape of a cantilever. The lens unit is arranged at the opening on the main substrate, and makes light applied to an inspecting object incline as the light goes further from the optical system.

1 ) A probe, comprising:
 a straight vertical portion;   a tip cantilever portion;   wherein a cross-section of said straight vertical portion is a rectangle; and   said tip cantilever portion is a planar shape in a same plane as said straight vertical portion.   
     
     
         2 ) A probe card unit comprising:
 a main substrate;   probes;   wherein said main substrate is provided with square fixing holes to be fixed with one end of said probes at a predetermined position thereon;   wherein said probes are arranged vertically;   wherein said probes are fixed in said fixing holes;   wherein said probes have a linear vertical portion;   wherein said probes have one end portion;   wherein said vertical portion has a vertically-extended shape and has a rectangle in a cross-sectional shape; and   wherein said one end portion has a planer cantilever-type shape, and the planer face of said one end portion and a face of the vertical portion are flush with each other.   
     
     
         3 ) The probe card unit of  claim 2 , wherein said probe is manufactured via MEMS technology. 
     
     
         4 ) The probe card unit of  claim 2 , further comprising a guide plate configured to restrict the vertical position of said probes to said predetermined position. 
     
     
         5 ) The probe card unit of  claim 4 , wherein said guide plate is provided with rectangular guide holes configured to align with said rectangle in a cross-sectional shape. 
     
     
         6 ) The probe card unit of  claim 3 , further comprising a guide plate configured to restrict the vertical position of said probes to said predetermined position. 
     
     
         7 ) The probe card unit of  claim 3 , wherein said guide plate is provided with rectangular guide holes configured to align with said rectangle in a cross-sectional shape. 
     
     
         8 ) The probe card unit of  claim 4 , wherein said probe is manufactured via MEMS technology. 
     
     
         9 ) The probe card unit of  claim 4 , wherein said guide plate is provided with rectangular guide holes configured to align with said rectangle in a cross-sectional shape. 
     
     
         10 ) The probe card unit of  claim 5 , wherein said probe is manufactured via MEMS technology.