US2012193030A1PendingUtilityA1

Silicon electrode plate for plasma etching

Assignee: KOMEKYU TAKASHIPriority: Jan 31, 2011Filed: Dec 19, 2011Published: Aug 2, 2012
Est. expiryJan 31, 2031(~4.5 yrs left)· nominal 20-yr term from priority
H10P 50/242H01J 37/3255
19
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

[Problems] To provide a silicon electrode plate for plasma etching that suppresses the unevenness of the surface caused by plasma etching so as to ensure uniform etching. [Means for Solving the Problems] The silicon electrode plate for plasma etching is constituted by single-crystal silicon in which B and Al have been added as dopants, wherein the concentration of Al is equal to or greater than 1×10 13 atoms/cm 3 . In the silicon electrode plate for plasma etching, the electrical characteristic of single-crystal silicon is made uniform in a plane. Thus, the occurrence of unevenness of the surface may be minimized when the surface is depleted during plasma etching, and the occurrence of cracks may be suppressed.

Claims

exact text as granted — not AI-modified
1 . A silicon electrode plate for plasma etching,
 wherein the silicon electrode plate is constituted by single-crystal silicon in which B and Al have been added as dopants and the concentration of Al is equal to or greater than 1×10 13  atoms/cm 3 .   
     
     
         2 . The silicon electrode plate for plasma etching according to  claim 1 , wherein the concentration of Al is equal to or less than 5×10 13  atoms/cm 3 .

Join the waitlist — get patent alerts

Track US2012193030A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.